Re: [PATCH v2 3/6] dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings

Evan Green
2020-01-31T21:36:31Z

On Thu, Jan 9, 2020 at 8:33 PM David Dai <daidavid1@codeaurora.org> wrote:
>
> Redefine the Network-on-Chip devices to more accurately describe
> the interconnect topology on Qualcomm's SDM845 platform. Each
> interconnect device can communicate with different instances of the
> RPMh hardware which are described as RSCs(Resource State Coordinators).
>
> Signed-off-by: David Dai <daidavid1@codeaurora.org>
> ---
> .../bindings/interconnect/qcom,sdm845.yaml | 49 ++++++++++++++++++----
> 1 file changed, 40 insertions(+), 9 deletions(-)
>

This patch doesn't seem to apply cleanly on top of patch 1 because of
whitespace context differences.

I'll use this as an opportunity to plug the "patman" tool, which lives
(weirdly) in the u-boot repository, but is an excellent way to manage
and spin upstream submissions.

-Evan