Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal <punit.agrawal@arm.com>]

Ping?

Punit Agrawal <punit.agrawal@arm.com> writes:

> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <rui.zhang@intel.com>
> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
>  drivers/thermal/of-thermal.c |    4 ++--
>  1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>  
>  			ret = thermal_zone_bind_cooling_device(thermal,
>  						tbp->trip_id, cdev,
> -						tbp->min,
> -						tbp->max);
> +						tbp->max,
> +						tbp->min);
>  			if (ret)
>  				return ret;
>  		}