From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org X-Spam-Level: X-Spam-Status: No, score=-16.3 required=3.0 tests=BAYES_00,DKIMWL_WL_HIGH, DKIM_SIGNED,DKIM_VALID,DKIM_VALID_AU,HEADER_FROM_DIFFERENT_DOMAINS, INCLUDES_CR_TRAILER,INCLUDES_PATCH,MAILING_LIST_MULTI,SPF_HELO_NONE,SPF_PASS, URIBL_BLOCKED autolearn=unavailable autolearn_force=no version=3.4.0 Received: from mail.kernel.org (mail.kernel.org [198.145.29.99]) by smtp.lore.kernel.org (Postfix) with ESMTP id 4453AC433E0 for ; Mon, 8 Feb 2021 12:17:11 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [23.128.96.18]) by mail.kernel.org (Postfix) with ESMTP id F055B64E29 for ; Mon, 8 Feb 2021 12:17:10 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S231366AbhBHMRA (ORCPT ); Mon, 8 Feb 2021 07:17:00 -0500 Received: from mail.kernel.org ([198.145.29.99]:40420 "EHLO mail.kernel.org" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S233445AbhBHL55 (ORCPT ); Mon, 8 Feb 2021 06:57:57 -0500 Received: by mail.kernel.org (Postfix) with ESMTPSA id 7998064E6E; Mon, 8 Feb 2021 11:57:09 +0000 (UTC) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=linuxfoundation.org; s=korg; t=1612785430; bh=UjSCVRlYlYz5lJ+/E0HItPpS4FLAKsZx0Wymr8k4yKg=; h=Date:From:To:Cc:Subject:References:In-Reply-To:From; b=kIbb+I40rvFB55fGxIaXy3dbufJPL7HvcyTfsLxGSqKTns8yKOg6qeUEGqHbQbrK8 l6QH9Oj0PFRYMhIfIj3QETw/ca49Lk8iiD5GzHn5Wu0F0RpD4hhI2/CKI8MmNnr+xZ YrRl6YwidC94NQSe3TZhVPHpslVJIB1XdhuVfc4c= Date: Mon, 8 Feb 2021 12:57:07 +0100 From: Greg Kroah-Hartman To: taehyun cho Cc: balbi@kernel.org, linux-usb@vger.kernel.org, linux-kernel@vger.kernel.org Subject: Re: [PATCH] usb: dwc3: make USB_DWC3_EXYNOS independent Message-ID: References: <20210208114538.134766-1-taehyun.cho@samsung.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <20210208114538.134766-1-taehyun.cho@samsung.com> Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Mon, Feb 08, 2021 at 08:45:38PM +0900, taehyun cho wrote: > 'ARCH_EXYNOS' is no more used. I do not understand this sentance. I see it used in many places in the kernel tree still, is it being removed? And if so, as of what commit is this true? > 'USB_DWC3_EXYNOS' is glue layer > which can be used with Synopsys DWC3 controller on Exynos SoCs. > 'USB_DWC3_EXYNOS' can be used from Exynos5 to Exynos9. This is fine, but the help text doesn't show this, why not put that information there? > > Signed-off-by: taehyun cho > --- > drivers/usb/dwc3/Kconfig | 4 ++-- > 1 file changed, 2 insertions(+), 2 deletions(-) > > diff --git a/drivers/usb/dwc3/Kconfig b/drivers/usb/dwc3/Kconfig > index 2133acf8ee69..dc2f92ac8ef6 100644 > --- a/drivers/usb/dwc3/Kconfig > +++ b/drivers/usb/dwc3/Kconfig > @@ -67,10 +67,10 @@ config USB_DWC3_OMAP > > config USB_DWC3_EXYNOS > tristate "Samsung Exynos Platform" > - depends on (ARCH_EXYNOS || COMPILE_TEST) && OF > + depends on (USB_DWC3 || COMPILE_TEST) && OF > default USB_DWC3 > help > - Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside, > + Exynos SoCs chip with one DesignWare Core USB3 IP inside, This does not make much sense anymore, can you reword it? thanks, greg k-h