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Fri, 06 Mar 2026 01:09:52 -0800 (PST) Received: from mai.linaro.org ([2a05:6e02:1041:c10:1265:158c:17d1:c76e]) by smtp.gmail.com with ESMTPSA id ffacd0b85a97d-439dae2b9fbsm2393780f8f.23.2026.03.06.01.09.51 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Fri, 06 Mar 2026 01:09:52 -0800 (PST) Date: Fri, 6 Mar 2026 10:09:50 +0100 From: Daniel Lezcano To: Gaurav Kohli Cc: andersson@kernel.org, mathieu.poirier@linaro.org, robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org, rui.zhang@intel.com, lukasz.luba@arm.com, konradybcio@kernel.org, mani@kernel.org, casey.connolly@linaro.org, amit.kucheria@oss.qualcomm.com, linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, manaf.pallikunhi@oss.qualcomm.com Subject: Re: [PATCH v2 0/8] Add RemoteProc cooling support Message-ID: References: <20260127155722.2797783-1-gaurav.kohli@oss.qualcomm.com> Precedence: bulk X-Mailing-List: linux-kernel@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <20260127155722.2797783-1-gaurav.kohli@oss.qualcomm.com> X-Proofpoint-ORIG-GUID: jHId0SKKVLScIf6zceW2ZiG77ZiHd35i X-Authority-Analysis: v=2.4 cv=LegxKzfi c=1 sm=1 tr=0 ts=69aa99e1 cx=c_pps a=qKBjSQ1v91RyAK45QCPf5w==:117 a=xqWC_Br6kY4A:10 a=kj9zAlcOel0A:10 a=Yq5XynenixoA:10 a=s4-Qcg_JpJYA:10 a=VkNPw1HP01LnGYTKEx00:22 a=u7WPNUs3qKkmUXheDGA7:22 a=ZpdpYltYx_vBUK5n70dp:22 a=VwQbUJbxAAAA:8 a=KKAkSRfTAAAA:8 a=EUspDBNiAAAA:8 a=BEq6MHY0i-NMwquLpTMA:9 a=CjuIK1q_8ugA:10 a=NFOGd7dJGGMPyQGDc5-O:22 a=cvBusfyB2V15izCimMoJ:22 X-Proofpoint-Spam-Details-Enc: AW1haW4tMjYwMzA2MDA4NiBTYWx0ZWRfXxqriyfle/VDp Yr76ASQyVVdoZGBkC9pfom/QwA4Hk6GXuecONMZUi2pRNJtj322L2WMPvup7rsWRy1b0kRhROVF FhliyjoUQdhdlBBQyjPnNkUkbvBtGHyaubRJ3CAlsJ1N19pTYEGIszzJ1oQV6TeybuzRa5+rNYH l/62Yezu6jqYn7HwCblQ3uyf5BPZzFAnqMvlE/p2OXDBxEsm9Wi3M7KyvvupOhp5GxoEpFXq6cg JJfrCY2MqrVYQWIPZHZ0HjhimYLyIafC0gI9i2KAGpAHYUo5TcptwgXm6DmdDdTAl4ByjFXjl5N NOHgn2TiUS2B11QpKp60JvStEksfRH8/hGO+Rwb/q5T3lej+47qNezBscRg/qA40f4qPN2S3Bjo vQvB+PcfQhmydyeCZHZHSIVZZL41urqTqrtQcpGTX5EU42MBtg0FKt/DAcpo8JgUpXc9APtI0Rz at5+WAybZUyroSUUULQ== X-Proofpoint-GUID: jHId0SKKVLScIf6zceW2ZiG77ZiHd35i X-Proofpoint-Virus-Version: vendor=baseguard engine=ICAP:2.0.293,Aquarius:18.0.1143,Hydra:6.1.51,FMLib:17.12.100.49 definitions=2026-03-06_03,2026-03-04_01,2025-10-01_01 X-Proofpoint-Spam-Details: rule=outbound_notspam policy=outbound score=0 clxscore=1015 impostorscore=0 malwarescore=0 adultscore=0 lowpriorityscore=0 priorityscore=1501 phishscore=0 bulkscore=0 spamscore=0 suspectscore=0 classifier=typeunknown authscore=0 authtc= authcc= route=outbound adjust=0 reason=mlx scancount=1 engine=8.22.0-2602130000 definitions=main-2603060086 Hi Gaurav, On Tue, Jan 27, 2026 at 09:27:14PM +0530, Gaurav Kohli wrote: > This series introduces a generic remote proc cooling framework to control > thermal sensors located on remote subsystem like modem, dsp etc. > Communications with these subsystems occurs through various channels, for example, > QMI interface for Qualcomm. Can you clarify the semantic of the driver ? It is described as controlling the thermal sensors, except I'm missing something my understanding it controls the level of performance of a subsystem where a thermal sensor is tied to. > The Framework provides an abstraction layer between thermal subsytem and vendor > specific remote subsystem. Vendor drivers are expected to implement callback > and registration mechanisms with cooling framework to control cooling > devices. > > This patchset also revives earlier discussions of QMI based TMD cooling > devices discussion posted on below series by Casey: > https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/ > > That series introduced Qualcomm QMI-based TMD cooling devices which used > to mitigate thermal conditions across multiple remote subsystems. These > devices operate based on junction temperature sensors (TSENS) associated > with thermal zones for each subsystem and registering with remoteproc > cooling framework for cooling registration. > --- > Changes in v2: > - Update Remoreproc thermal config to tristate and removed unnecessary NULL checks. > - Fixed dt binding file format and added generic name support for cdsp. > - Fixed memory leak and cleaned up qmi-cooling driver file. > - Corrected DT formatting errors and commit descriptions for all targets. > - Link to v1: https://lore.kernel.org/linux-devicetree/20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com/ > --- > > Casey Connolly (2): > remoteproc: qcom: probe all child devices > thermal: qcom: add qmi-cooling driver > > Gaurav Kohli (6): > thermal: Add Remote Proc cooling driver > dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings > arm64: dts: qcom: lemans: Enable CDSP cooling > arm64: dts: qcom: talos: Enable CDSP cooling > arm64: dts: qcom: kodiak: Enable CDSP cooling > arm64: dts: qcom: monaco: Enable CDSP cooling > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 + > .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++ > MAINTAINERS | 7 + > arch/arm64/boot/dts/qcom/kodiak.dtsi | 37 ++ > arch/arm64/boot/dts/qcom/lemans.dtsi | 138 ++++- > arch/arm64/boot/dts/qcom/monaco.dtsi | 93 ++++ > arch/arm64/boot/dts/qcom/talos.dtsi | 24 + > drivers/remoteproc/qcom_q6v5.c | 4 + > drivers/remoteproc/qcom_q6v5_mss.c | 8 - > drivers/soc/qcom/Kconfig | 13 + > drivers/soc/qcom/Makefile | 1 + > drivers/soc/qcom/qmi-cooling.c | 510 ++++++++++++++++++ > drivers/soc/qcom/qmi-cooling.h | 429 +++++++++++++++ > drivers/thermal/Kconfig | 10 + > drivers/thermal/Makefile | 2 + > drivers/thermal/remoteproc_cooling.c | 143 +++++ > include/linux/remoteproc_cooling.h | 52 ++ > 17 files changed, 1529 insertions(+), 20 deletions(-) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > create mode 100644 drivers/soc/qcom/qmi-cooling.c > create mode 100644 drivers/soc/qcom/qmi-cooling.h > create mode 100644 drivers/thermal/remoteproc_cooling.c > create mode 100644 include/linux/remoteproc_cooling.h > > -- > 2.34.1 > --