Re: [PATCH v3 08/14] thermal: core: Unexport thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip()

lihuisong (C)
2024-08-21T09:19:11Z

在 2024/8/20 0:05, Rafael J. Wysocki 写道:
> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>
> Since thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip()
> are only called locally in the thermal core now, they can be static,
> so change their definitions accordingly and drop their headers from
> the global thermal header file.
The thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip() are
used by acpi/thermal.c.
I guess that the patch [07/14] I didn't receive must have done that.
If so, I'd like add:
Acked-by: Huisong Li <lihuisong@huawei.com>
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> ---
>
> v2 -> v3: Rebase after dropping patches [04-05/17] from the series
>
> v1 -> v2: No changes
>
> ---
> drivers/thermal/thermal_core.c | 10 ++++------
> include/linux/thermal.h | 8 --------
> 2 files changed, 4 insertions(+), 14 deletions(-)
>
> Index: linux-pm/drivers/thermal/thermal_core.c
> ===================================================================
> --- linux-pm.orig/drivers/thermal/thermal_core.c
> +++ linux-pm/drivers/thermal/thermal_core.c
> @@ -773,7 +773,7 @@ struct thermal_zone_device *thermal_zone
> *
> * Return: 0 on success, the proper error value otherwise.
> */
> -int thermal_bind_cdev_to_trip(struct thermal_zone_device *tz,
> +static int thermal_bind_cdev_to_trip(struct thermal_zone_device *tz,
> const struct thermal_trip *trip,
> struct thermal_cooling_device *cdev,
> unsigned long upper, unsigned long lower,
> @@ -877,7 +877,6 @@ free_mem:
> kfree(dev);
> return result;
> }
> -EXPORT_SYMBOL_GPL(thermal_bind_cdev_to_trip);
>
> int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
> int trip_index,
> @@ -913,9 +912,9 @@ EXPORT_SYMBOL_GPL(thermal_zone_bind_cool
> *
> * Return: 0 on success, the proper error value otherwise.
> */
> -int thermal_unbind_cdev_from_trip(struct thermal_zone_device *tz,
> - const struct thermal_trip *trip,
> - struct thermal_cooling_device *cdev)
> +static int thermal_unbind_cdev_from_trip(struct thermal_zone_device *tz,
> + const struct thermal_trip *trip,
> + struct thermal_cooling_device *cdev)
> {
> struct thermal_instance *pos, *next;
>
> @@ -945,7 +944,6 @@ unbind:
> kfree(pos);
> return 0;
> }
> -EXPORT_SYMBOL_GPL(thermal_unbind_cdev_from_trip);
>
> int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
<...>
>
>
>
>
> .