Re: [PATCH v3 14/14] thermal: core: Clean up trip bind/unbind functions

Daniel Lezcano
2024-08-21T14:29:21Z

On 19/08/2024 18:33, Rafael J. Wysocki wrote:
> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>
> Make thermal_bind_cdev_to_trip() take a struct cooling_spec pointer
> to reduce the number of its arguments, change the return type of
> thermal_unbind_cdev_from_trip() to void and rearrange the code in
> thermal_zone_cdev_binding() to reduce the indentation level.
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> ---
>
> v2 -> v3: Subject fix
>
> v1-> v2: No changes
>
> ---
> drivers/thermal/thermal_core.c | 54 +++++++++++++++--------------------------
> 1 file changed, 21 insertions(+), 33 deletions(-)
>
> Index: linux-pm/drivers/thermal/thermal_core.c
> ===================================================================
> --- linux-pm.orig/drivers/thermal/thermal_core.c
> +++ linux-pm/drivers/thermal/thermal_core.c
> @@ -757,15 +757,7 @@ struct thermal_zone_device *thermal_zone
> * @tz: pointer to struct thermal_zone_device
> * @trip: trip point the cooling devices is associated with in this zone.
> * @cdev: pointer to struct thermal_cooling_device
> - * @upper: the Maximum cooling state for this trip point.
> - * THERMAL_NO_LIMIT means no upper limit,
> - * and the cooling device can be in max_state.
> - * @lower: the Minimum cooling state can be used for this trip point.
> - * THERMAL_NO_LIMIT means no lower limit,
> - * and the cooling device can be in cooling state 0.
> - * @weight: The weight of the cooling device to be bound to the
> - * thermal zone. Use THERMAL_WEIGHT_DEFAULT for the
> - * default value
> + * @c: cooling specification for @trip and @cdev

s/c/cspec/ at least :)

Other than that

Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |