Re: [PATCH v3 14/14] thermal: core: Clean up trip bind/unbind functions

lihuisong (C)
2024-08-21T09:34:16Z

在 2024/8/20 0:33, Rafael J. Wysocki 写道:
> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>
> Make thermal_bind_cdev_to_trip() take a struct cooling_spec pointer
> to reduce the number of its arguments, change the return type of
> thermal_unbind_cdev_from_trip() to void and rearrange the code in
> thermal_zone_cdev_binding() to reduce the indentation level.
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> ---

Acked-by: Huisong Li <lihuisong@huawei.com>

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