[PATCH v2 0/2] Fixed stacked vlan usage on top of bonds

[Vlad Yasevich <vyasevic@redhat.com>]

Bonding device driver now support q-in-q on top for bonds.  There are
a few issues here though.

First, when arp monitoring is used, bonding driver will not correctly
tag traffic if the source of the arp device was configured on top of
q-in-q.  It may also incorrectly pick the wrong vlan id if the ordering
of that upper devices isn't as expected (there is no guarntee on ordering).

Second, the alb/tlb may use what would be considered 'inner' vlans in
its learning announcements, as it simply announces all vlans configured
on top of the bond without regard for encapsulation/stacking.

This series fixes the above 2 issues.  This series also depends on the
functionality introduced in
	http://patchwork.ozlabs.org/patch/349766/

Since v1:
  - Changed how patch1 verifies the device path.  We no longer use the
    _all_upper version of the function.  We find the path and if it was
    found, then collect the vlan information.
  - Use the constant to devine maximum vlan nest level support on top
    of bonding.  This can be changed if 2 is too low.
  - Inlude patch2 into the series.

Vlad Yasevich (2):
  bonding: Fix stacked device detection in arp monitoring
  bonding: Fix alb mode to only use first level vlans.

 drivers/net/bonding/bond_alb.c  |   2 +-
 drivers/net/bonding/bond_main.c | 134 +++++++++++++++++++---------------------
 drivers/net/bonding/bonding.h   |   1 +
 include/linux/if_vlan.h         |   6 ++
 include/linux/netdevice.h       |   9 +++
 net/core/dev.c                  |  26 ++++++++
 6 files changed, 108 insertions(+), 70 deletions(-)

-- 
1.9.0