From mboxrd@z Thu Jan 1 00:00:00 1970 From: Amir Noam Subject: Re: major bonding bug? Date: Tue, 30 Dec 2003 18:45:14 +0200 Sender: netdev-bounce@oss.sgi.com Message-ID: <200312301845.14275.amir.noam@intel.com> References: Mime-Version: 1.0 Content-Type: text/plain; charset="iso-8859-1" Content-Transfer-Encoding: 7bit Cc: "Marom, Noam" , , Return-path: To: "Jeff Garzik" , "Hen, Shmulik" In-Reply-To: Content-Disposition: inline Errors-to: netdev-bounce@oss.sgi.com List-Id: netdev.vger.kernel.org On Tuesday 30 December 2003 06:31 pm, Jeff Garzik wrote: > hmmm... > > > It looks like a lot of code now depends on global variable > "bond_mode". Actually, this has always been the case in the bonding module. > This looks very wrong... bonding mode should be per-interface, not > global to the entire driver. What happens when a user wants > BOND_MODE_ROUNDROBIN on bond0, and BOND_MODE_TLB on bond1? We agree that it looks very wrong, and this is in fact one of the features we've been working on lately. It is not a trivial fix, since, as you've noted, a lot of the code depends on the bond settings being global. We plan to start releasing patches to address this issue very soon (probably even starting tomorrow). -- Amir