From: Simon Horman <horms@kernel.org>
To: Grzegorz Nitka <grzegorz.nitka@intel.com>
Cc: intel-wired-lan@lists.osuosl.org, netdev@vger.kernel.org
Subject: Re: [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP sections for E825C
Date: Tue, 12 Dec 2023 10:02:06 +0000 [thread overview]
Message-ID: <20231212100206.GW5817@kernel.org> (raw)
In-Reply-To: <20231206192919.3826128-4-grzegorz.nitka@intel.com>
On Wed, Dec 06, 2023 at 08:29:19PM +0100, Grzegorz Nitka wrote:
> E825C devices shall support the new signing type of RSA 3K for new DDP
> section (SEGMENT_SIGN_TYPE_RSA3K_E825 (5) - already in the code).
> The driver is responsible to verify the presence of correct signing type.
> Add 3k signinig support for E825C devices based on mac_type:
> ICE_MAC_GENERIC_3K_E825;
>
> Signed-off-by: Grzegorz Nitka <grzegorz.nitka@intel.com>
Reviewed-by: Simon Horman <horms@kernel.org>
next prev parent reply other threads:[~2023-12-12 10:02 UTC|newest]
Thread overview: 11+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-12-06 19:29 [PATCH iwl-next v1 0/3] ice: add E825C device family support Grzegorz Nitka
2023-12-06 19:29 ` [PATCH iwl-next v1 1/3] ice: introduce new E825C devices family Grzegorz Nitka
2023-12-12 10:01 ` Simon Horman
2024-01-08 4:50 ` [Intel-wired-lan] " Pucha, HimasekharX Reddy
2023-12-06 19:29 ` [PATCH iwl-next v1 2/3] ice: Add helper function ice_is_generic_mac Grzegorz Nitka
2023-12-12 10:01 ` Simon Horman
2024-01-08 4:53 ` [Intel-wired-lan] " Pucha, HimasekharX Reddy
2023-12-06 19:29 ` [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP sections for E825C Grzegorz Nitka
2023-12-12 10:02 ` Simon Horman [this message]
2024-01-08 4:55 ` [Intel-wired-lan] " Pucha, HimasekharX Reddy
2023-12-07 9:11 ` [PATCH iwl-next v1 0/3] ice: add E825C device family support Mateusz Polchlopek
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