Re: [PATCH v2 0/5] thermal: rockchip: add tsadc support in thermal driver and IPA thermal control for rk3328 in dts

[Zhang Rui <rui.zhang@intel.com>]

On Fri, 2017-08-11 at 08:27 +0200, Heiko Stuebner wrote:
> Hi,
> 
> Am Freitag, 11. August 2017, 12:51:35 CEST schrieb Zhang Rui:
> > 
> > On Fri, 2017-08-04 at 16:06 +0800, Rocky Hao wrote:
> > > 
> > > This series patches add the tsadc support in thermal driver and
> > > in
> > > devicetree for rk3328.
> > > Also add thermal control with Intelligent Power Allocation (IPA)
> > > policy by default.  Please
> > > refer to https://developer.arm.com/open-source/intelligent-power-
> > > allo
> > > cation for more information
> > > about IPA.
> > > 
> > > Rocky Hao (5):
> > >   dt-bindings: rockchip-thermal: Support the RK3328 SoC
> > > compatible
> > >   thermal: rockchip: Support the RK3328 SOC in thermal driver
> > >   arm64: dts: rockchip: add tsadc node for rk3328 SoC
> > >   arm64: dts: rockchip: add thermal nodes for rk3328 SoC
> > >   arm64: dts: rockchip: Enable tsadc module on RK3328 eavluation
> > > board
> > > 
> > I can take this patch set if we have ACK for patch 3, 4 and 5.
> I would prefer if you would just apply patches 1+2 alone and I'd take
> the devicetree patches through my tree.
> 
> Having devicetree stuff mingle in a lot of trees produces unnecessary
> conflicts, so the general best practice is having code + binding.txt
> going through the driver tree and devicetree stuff through the
> platform
> tree.
> 
OKay, I will take patch 1 and 2 and queue them for next merge window.

thanks,
rui
> 
> Thanks
> Heiko
>