[PATCH] bonding: fix multiple module load problem

[Stephen Hemminger <shemminger@vyatta.com>]

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>

---
Since 2.6.30 is now out this needs to goto the first stable 2.6.30.1
tree.

--- a/drivers/net/bonding/bond_sysfs.c	2009-06-09 10:07:29.618979856 -0700
+++ b/drivers/net/bonding/bond_sysfs.c	2009-06-09 10:18:04.039973238 -0700
@@ -1538,6 +1538,7 @@ int bond_create_sysfs(void)
 			printk(KERN_ERR
 			       "network device named %s already exists in sysfs",
 			       class_attr_bonding_masters.attr.name);
+		ret = 0;
 	}
 
 	return ret;