Re: [PATCH 1/6] dt-bindings: arm: ti: Add bindings for J721E SoC

From: Rob Herring <robh@kernel.org>
Cc: Arnd Bergmann <arnd@arndb.de>, Olof Johansson <olof@lixom.net>,
	Santosh Shilimkar <ssantosh@kernel.org>,
	Will Deacon <will.deacon@arm.com>,
	Catalin Marinas <catalin.marinas@arm.com>,
	Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
	Mark Rutland <mark.rutland@arm.com>,
	Rob Herring <robh+dt@kernel.org>,
	linux-serial@vger.kernel.org, linux-kernel@vger.kernel.org,
	devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org,
	Tony Lindgren <tony@atomide.com>,
	Russell King <linux@armlinux.org.uk>,
	Tero Kristo <t-kristo@ti.com>, Nishanth Menon <nm@ti.com>
Subject: Re: [PATCH 1/6] dt-bindings: arm: ti: Add bindings for J721E SoC
Date: Fri, 14 Jun 2019 10:45:36 -0600	[thread overview]
Message-ID: <20190614164536.GA18039@bogus> (raw)
In-Reply-To: <20190522161921.20750-2-nm@ti.com>

On Wed, 22 May 2019 11:19:16 -0500, Nishanth Menon wrote:
> The J721E SoC belongs to the K3 Multicore SoC architecture platform,
> providing advanced system integration to enable lower system costs
> of automotive applications such as infotainment, cluster, premium
> Audio, Gateway, industrial and a range of broad market applications.
> This SoC is designed around reducing the system cost by eliminating
> the need of an external system MCU and is targeted towards ASIL-B/C
> certification/requirements in addition to allowing complex software
> and system use-cases.
> 
> Some highlights of this SoC are:
> * Dual Cortex-A72s in a single cluster, three clusters of lockstep
>   capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA),
>   C7x floating point Vector DSP, Two C66x floating point DSPs.
> * 3D GPU PowerVR Rogue 8XE GE8430
> * Vision Processing Accelerator (VPAC) with image signal processor and Depth
>   and Motion Processing Accelerator (DMPAC)
> * Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual
>   PRUs and dual RTUs
> * Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and
>   up to two DPI interfaces.
> * Integrated Ethernet switch supporting up to a total of 8 external ports in
>   addition to legacy Ethernet switch of up to 2 ports.
> * System MMU (SMMU) Version 3.0 and advanced virtualisation
>   capabilities.
> * Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems,
>   16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI,
>   I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals.
> * Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
>   management.
> * Configurable L3 Cache and IO-coherent architecture with high data throughput
>   capable distributed DMA architecture under NAVSS
> * Centralized System Controller for Security, Power, and Resource
>   Management (DMSC)
> 
> See J721E Technical Reference Manual (SPRUIL1, May 2019)
> for further details: http://www.ti.com/lit/pdf/spruil1
> 
> Signed-off-by: Nishanth Menon <nm@ti.com>
> ---
>  Documentation/devicetree/bindings/arm/ti/k3.txt | 3 +++
>  1 file changed, 3 insertions(+)
> 

Reviewed-by: Rob Herring <robh@kernel.org>