From: Rudolf Marek <r.marek@assembler.cz>
To: lm-sensors@vger.kernel.org
Subject: Re: [lm-sensors] New winbond chip: W83667HG
Date: Wed, 10 Sep 2008 20:40:52 +0000 [thread overview]
Message-ID: <48C830D4.6010402@assembler.cz> (raw)
In-Reply-To: <200807072054.10321.phhusson@free.fr>
Hi Pierre
I have the datasheet! Can you post here some dumps so I can check it what is the
real revision of the chip?
isadump 0x295 0x296 0
and also:
isadump 0x2e 0x2f -k 0x87,0x87
Thank you.
Rudolf
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next prev parent reply other threads:[~2008-09-10 20:40 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2008-07-07 18:54 [lm-sensors] New winbond chip: W83667HG Pierre-Hugues HUSSON
2008-07-07 21:04 ` Rudolf Marek
2008-09-10 20:40 ` Rudolf Marek [this message]
2008-09-10 21:06 ` Rudolf Marek
2008-09-12 9:56 ` Marco Chiappero
2008-09-12 10:42 ` Jean Delvare
2008-09-12 11:03 ` Marco Chiappero
2008-09-13 9:58 ` Iain Paton
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