From: Rudolf Marek <r.marek@assembler.cz>
To: lm-sensors@vger.kernel.org
Subject: Re: [lm-sensors] New winbond chip: W83667HG
Date: Mon, 07 Jul 2008 21:04:55 +0000 [thread overview]
Message-ID: <487284F7.5030504@assembler.cz> (raw)
In-Reply-To: <200807072054.10321.phhusson@free.fr>
Hello Gong Jun,
Sorry I forgot what is your first name. I think Jun, but not sure ;)
Would you be so kind and get us a datasheet for the W83667HG? Please just send
it to me Jean and David (usual suspects ;). The chip seems to be similar to
W83627EHG/DHG. Best would be to get some diff documentation - eg what is
different from previous generation, like we had for DHG. I dont have much time
left, but I can at least try to help with the support/implementation. If it is
easy/doable in short time I can even do that.
If you have some public version of datasheet please ask to put it on the Winbond
site. I dont know if binary attachments are allowed for mailing list.
Thank you,
Rudolf
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next prev parent reply other threads:[~2008-07-07 21:04 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2008-07-07 18:54 [lm-sensors] New winbond chip: W83667HG Pierre-Hugues HUSSON
2008-07-07 21:04 ` Rudolf Marek [this message]
2008-09-10 20:40 ` Rudolf Marek
2008-09-10 21:06 ` Rudolf Marek
2008-09-12 9:56 ` Marco Chiappero
2008-09-12 10:42 ` Jean Delvare
2008-09-12 11:03 ` Marco Chiappero
2008-09-13 9:58 ` Iain Paton
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