From: Eduardo Valentin <eduardo.valentin-l0cyMroinI0@public.gmane.org>
To: rui.zhang-ral2JQCrhuEAvxtiuMwx3w@public.gmane.org,
linux-0h96xk9xTtrk1uMJSBkQmQ@public.gmane.org,
mark.rutland-5wv7dgnIgG8@public.gmane.org,
khali-PUYAD+kWke1g9hUCZPvPmw@public.gmane.org
Cc: wni-DDmLM1+adcrQT0dZR+AlfA@public.gmane.org,
durgadoss.r-ral2JQCrhuEAvxtiuMwx3w@public.gmane.org,
linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
lm-sensors-GZX6beZjE8VD60Wz+7aTrA@public.gmane.org,
linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
eduardo.valentin-l0cyMroinI0@public.gmane.org
Subject: Re: [GIT PULL] Thermal and Device tree
Date: Mon, 25 Nov 2013 11:51:41 -0400 [thread overview]
Message-ID: <5293720D.5070605@ti.com> (raw)
In-Reply-To: <1385390669-7613-1-git-send-email-eduardo.valentin-l0cyMroinI0@public.gmane.org>
[-- Attachment #1: Type: text/plain, Size: 6638 bytes --]
Hello again Rui,
On 25-11-2013 10:44, Eduardo Valentin wrote:
> Hello Rui,
>
> Please consider the following changes for 3.14. It contains the work of
> representing hardware thermal using device tree. It also contains
> three examples on how to use the new representation on sensor devices,
> using three different drivers to accomplish it. One driver is on thermal
> subsystem, the TI SoC thermal, and the other two drivers are in hwmon
> subsystem. I also included a change on cpu cooling device, which required
> also a change on cpufreq-cpu0 driver. The change on this cooling device
> still keeps in one piece its usage on different platforms.
>
> Because it is a controversial topic due to the lack of standards, and
> because it touches different subsystems, it took way longer than I expected.
> However, I've been discussing in different channels, and I believe I got
> enough entropy now to go forward. We have acks from cpufreq folks (on ARM side)
> and from hwmon folks too. Raphael W., Jean D. and Mark R. have also
> reviewed this series. They agree with the core idea of the work.
FYI, Mark R. also acked the work on device tree binding behalf. And
after a couple of improvements on binding document suggested by Thomasz
F. and Mark. R, I uploaded in the same branch the resulting series.
Let me know if you have troubles pulling the series.
>
> It has been agreed that this is not the end of it. As I said I started
> with only three examples, but there are other potential drivers to use
> this API. So, I have agreed with Jean D., for instance, that this
> series would be first step of the complete work. Next would be to check
> other potential drivers to be converted and then validate the proposed
> API. Currently the thermal framework would be polling for device
> temperature, but we could implement a couple of call backs to setup
> update rate, thresholds and hysteresis too, for instance.
>
> On the other hand, I don't think the principle and concept would break
> after converting the remaining drivers. That is why I am sending this pull
> request.
>
> Another point is, as you can see, there are several points in this pull
> request that do not belong to thermal subsystem. It has been suggested
> by Guenter R. that in such cases, it is recommended to send the complete
> series via one single subsystem. Thus, I am sending via your queue.
>
> Lastly, I've also volunteered to maintain the upcoming thermal bindings.
> Then, you can see I am adding thermal bindings to our MAINTAINERS entry too.
>
>
> All best,
>
> The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197:
>
> Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800)
>
> are available in the git repository at:
>
>
> git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next
>
> for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5:
>
> MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400)
>
> ----------------------------------------------------------------
> Eduardo Valentin (20):
> thermal: allow registering without .get_temp
> thermal: introduce device tree parser
> thermal: core: introduce thermal_of_cooling_device_register
> thermal: cpu_cooling: introduce of_cpufreq_cooling_register
> cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties
> hwmon: lm75: expose to thermal fw via DT nodes
> hwmon: tmp102: expose to thermal fw via DT nodes
> thermal: ti-soc-thermal: use thermal DT infrastructure
> arm: dts: add omap4 CPU thermal data
> arm: dts: add omap4430 thermal data
> arm: dts: add omap4460 thermal data
> arm: dts: add cooling properties on omap4430 cpu node
> arm: dts: add cooling properties on omap4460 cpu node
> arm: dts: add omap5 GPU thermal data
> arm: dts: add omap5 CORE thermal data
> arm: dts: add omap5 thermal data
> arm: dts: add cooling properties on omap5 cpu node
> arm: dts: make OMAP443x bandgap node to belong to OCP
> arm: dts: make OMAP4460 bandgap node to belong to OCP
> MAINTAINERS: add thermal bindings entry in thermal domain
>
> .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 +
> .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++
> MAINTAINERS | 1 +
> arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 +
> arch/arm/boot/dts/omap443x.dtsi | 23 +-
> arch/arm/boot/dts/omap4460.dtsi | 29 +-
> arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5.dtsi | 15 +-
> drivers/cpufreq/Kconfig | 2 +-
> drivers/cpufreq/cpufreq-cpu0.c | 16 +
> drivers/hwmon/lm75.c | 35 +-
> drivers/hwmon/tmp102.c | 19 +
> drivers/thermal/Kconfig | 14 +
> drivers/thermal/Makefile | 1 +
> drivers/thermal/cpu_cooling.c | 56 +-
> drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++
> drivers/thermal/thermal_core.c | 77 +-
> drivers/thermal/thermal_core.h | 9 +
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +-
> include/dt-bindings/thermal/thermal.h | 17 +
> include/linux/cpu_cooling.h | 25 +
> include/linux/thermal.h | 32 +-
> 23 files changed, 1939 insertions(+), 51 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
> create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
> create mode 100644 drivers/thermal/of-thermal.c
> create mode 100644 include/dt-bindings/thermal/thermal.h
> --
> To unsubscribe from this list: send the line "unsubscribe linux-pm" in
> the body of a message to majordomo-u79uwXL29TY76Z2rM5mHXA@public.gmane.org
> More majordomo info at http://vger.kernel.org/majordomo-info.html
>
>
--
You have got to be excited about what you are doing. (L. Lamport)
Eduardo Valentin
[-- Attachment #2: OpenPGP digital signature --]
[-- Type: application/pgp-signature, Size: 295 bytes --]
WARNING: multiple messages have this Message-ID (diff)
From: Eduardo Valentin <eduardo.valentin@ti.com>
To: rui.zhang@intel.com, linux@roeck-us.net, mark.rutland@arm.com,
khali@linux-fr.org
Cc: wni@nvidia.com, durgadoss.r@intel.com, linux-pm@vger.kernel.org,
devicetree@vger.kernel.org, lm-sensors@lm-sensors.org,
linux-kernel@vger.kernel.org, eduardo.valentin@ti.com
Subject: Re: [lm-sensors] [GIT PULL] Thermal and Device tree
Date: Mon, 25 Nov 2013 15:51:41 +0000 [thread overview]
Message-ID: <5293720D.5070605@ti.com> (raw)
In-Reply-To: <1385390669-7613-1-git-send-email-eduardo.valentin@ti.com>
[-- Attachment #1.1: Type: text/plain, Size: 6614 bytes --]
Hello again Rui,
On 25-11-2013 10:44, Eduardo Valentin wrote:
> Hello Rui,
>
> Please consider the following changes for 3.14. It contains the work of
> representing hardware thermal using device tree. It also contains
> three examples on how to use the new representation on sensor devices,
> using three different drivers to accomplish it. One driver is on thermal
> subsystem, the TI SoC thermal, and the other two drivers are in hwmon
> subsystem. I also included a change on cpu cooling device, which required
> also a change on cpufreq-cpu0 driver. The change on this cooling device
> still keeps in one piece its usage on different platforms.
>
> Because it is a controversial topic due to the lack of standards, and
> because it touches different subsystems, it took way longer than I expected.
> However, I've been discussing in different channels, and I believe I got
> enough entropy now to go forward. We have acks from cpufreq folks (on ARM side)
> and from hwmon folks too. Raphael W., Jean D. and Mark R. have also
> reviewed this series. They agree with the core idea of the work.
FYI, Mark R. also acked the work on device tree binding behalf. And
after a couple of improvements on binding document suggested by Thomasz
F. and Mark. R, I uploaded in the same branch the resulting series.
Let me know if you have troubles pulling the series.
>
> It has been agreed that this is not the end of it. As I said I started
> with only three examples, but there are other potential drivers to use
> this API. So, I have agreed with Jean D., for instance, that this
> series would be first step of the complete work. Next would be to check
> other potential drivers to be converted and then validate the proposed
> API. Currently the thermal framework would be polling for device
> temperature, but we could implement a couple of call backs to setup
> update rate, thresholds and hysteresis too, for instance.
>
> On the other hand, I don't think the principle and concept would break
> after converting the remaining drivers. That is why I am sending this pull
> request.
>
> Another point is, as you can see, there are several points in this pull
> request that do not belong to thermal subsystem. It has been suggested
> by Guenter R. that in such cases, it is recommended to send the complete
> series via one single subsystem. Thus, I am sending via your queue.
>
> Lastly, I've also volunteered to maintain the upcoming thermal bindings.
> Then, you can see I am adding thermal bindings to our MAINTAINERS entry too.
>
>
> All best,
>
> The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197:
>
> Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800)
>
> are available in the git repository at:
>
>
> git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next
>
> for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5:
>
> MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400)
>
> ----------------------------------------------------------------
> Eduardo Valentin (20):
> thermal: allow registering without .get_temp
> thermal: introduce device tree parser
> thermal: core: introduce thermal_of_cooling_device_register
> thermal: cpu_cooling: introduce of_cpufreq_cooling_register
> cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties
> hwmon: lm75: expose to thermal fw via DT nodes
> hwmon: tmp102: expose to thermal fw via DT nodes
> thermal: ti-soc-thermal: use thermal DT infrastructure
> arm: dts: add omap4 CPU thermal data
> arm: dts: add omap4430 thermal data
> arm: dts: add omap4460 thermal data
> arm: dts: add cooling properties on omap4430 cpu node
> arm: dts: add cooling properties on omap4460 cpu node
> arm: dts: add omap5 GPU thermal data
> arm: dts: add omap5 CORE thermal data
> arm: dts: add omap5 thermal data
> arm: dts: add cooling properties on omap5 cpu node
> arm: dts: make OMAP443x bandgap node to belong to OCP
> arm: dts: make OMAP4460 bandgap node to belong to OCP
> MAINTAINERS: add thermal bindings entry in thermal domain
>
> .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 +
> .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++
> MAINTAINERS | 1 +
> arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 +
> arch/arm/boot/dts/omap443x.dtsi | 23 +-
> arch/arm/boot/dts/omap4460.dtsi | 29 +-
> arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5.dtsi | 15 +-
> drivers/cpufreq/Kconfig | 2 +-
> drivers/cpufreq/cpufreq-cpu0.c | 16 +
> drivers/hwmon/lm75.c | 35 +-
> drivers/hwmon/tmp102.c | 19 +
> drivers/thermal/Kconfig | 14 +
> drivers/thermal/Makefile | 1 +
> drivers/thermal/cpu_cooling.c | 56 +-
> drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++
> drivers/thermal/thermal_core.c | 77 +-
> drivers/thermal/thermal_core.h | 9 +
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +-
> include/dt-bindings/thermal/thermal.h | 17 +
> include/linux/cpu_cooling.h | 25 +
> include/linux/thermal.h | 32 +-
> 23 files changed, 1939 insertions(+), 51 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
> create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
> create mode 100644 drivers/thermal/of-thermal.c
> create mode 100644 include/dt-bindings/thermal/thermal.h
> --
> To unsubscribe from this list: send the line "unsubscribe linux-pm" in
> the body of a message to majordomo@vger.kernel.org
> More majordomo info at http://vger.kernel.org/majordomo-info.html
>
>
--
You have got to be excited about what you are doing. (L. Lamport)
Eduardo Valentin
[-- Attachment #1.2: OpenPGP digital signature --]
[-- Type: application/pgp-signature, Size: 295 bytes --]
[-- Attachment #2: Type: text/plain, Size: 153 bytes --]
_______________________________________________
lm-sensors mailing list
lm-sensors@lm-sensors.org
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WARNING: multiple messages have this Message-ID (diff)
From: Eduardo Valentin <eduardo.valentin@ti.com>
To: <rui.zhang@intel.com>, <linux@roeck-us.net>,
<mark.rutland@arm.com>, <khali@linux-fr.org>
Cc: <wni@nvidia.com>, <durgadoss.r@intel.com>,
<linux-pm@vger.kernel.org>, <devicetree@vger.kernel.org>,
<lm-sensors@lm-sensors.org>, <linux-kernel@vger.kernel.org>,
<eduardo.valentin@ti.com>
Subject: Re: [GIT PULL] Thermal and Device tree
Date: Mon, 25 Nov 2013 11:51:41 -0400 [thread overview]
Message-ID: <5293720D.5070605@ti.com> (raw)
In-Reply-To: <1385390669-7613-1-git-send-email-eduardo.valentin@ti.com>
[-- Attachment #1: Type: text/plain, Size: 6614 bytes --]
Hello again Rui,
On 25-11-2013 10:44, Eduardo Valentin wrote:
> Hello Rui,
>
> Please consider the following changes for 3.14. It contains the work of
> representing hardware thermal using device tree. It also contains
> three examples on how to use the new representation on sensor devices,
> using three different drivers to accomplish it. One driver is on thermal
> subsystem, the TI SoC thermal, and the other two drivers are in hwmon
> subsystem. I also included a change on cpu cooling device, which required
> also a change on cpufreq-cpu0 driver. The change on this cooling device
> still keeps in one piece its usage on different platforms.
>
> Because it is a controversial topic due to the lack of standards, and
> because it touches different subsystems, it took way longer than I expected.
> However, I've been discussing in different channels, and I believe I got
> enough entropy now to go forward. We have acks from cpufreq folks (on ARM side)
> and from hwmon folks too. Raphael W., Jean D. and Mark R. have also
> reviewed this series. They agree with the core idea of the work.
FYI, Mark R. also acked the work on device tree binding behalf. And
after a couple of improvements on binding document suggested by Thomasz
F. and Mark. R, I uploaded in the same branch the resulting series.
Let me know if you have troubles pulling the series.
>
> It has been agreed that this is not the end of it. As I said I started
> with only three examples, but there are other potential drivers to use
> this API. So, I have agreed with Jean D., for instance, that this
> series would be first step of the complete work. Next would be to check
> other potential drivers to be converted and then validate the proposed
> API. Currently the thermal framework would be polling for device
> temperature, but we could implement a couple of call backs to setup
> update rate, thresholds and hysteresis too, for instance.
>
> On the other hand, I don't think the principle and concept would break
> after converting the remaining drivers. That is why I am sending this pull
> request.
>
> Another point is, as you can see, there are several points in this pull
> request that do not belong to thermal subsystem. It has been suggested
> by Guenter R. that in such cases, it is recommended to send the complete
> series via one single subsystem. Thus, I am sending via your queue.
>
> Lastly, I've also volunteered to maintain the upcoming thermal bindings.
> Then, you can see I am adding thermal bindings to our MAINTAINERS entry too.
>
>
> All best,
>
> The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197:
>
> Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800)
>
> are available in the git repository at:
>
>
> git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next
>
> for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5:
>
> MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400)
>
> ----------------------------------------------------------------
> Eduardo Valentin (20):
> thermal: allow registering without .get_temp
> thermal: introduce device tree parser
> thermal: core: introduce thermal_of_cooling_device_register
> thermal: cpu_cooling: introduce of_cpufreq_cooling_register
> cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties
> hwmon: lm75: expose to thermal fw via DT nodes
> hwmon: tmp102: expose to thermal fw via DT nodes
> thermal: ti-soc-thermal: use thermal DT infrastructure
> arm: dts: add omap4 CPU thermal data
> arm: dts: add omap4430 thermal data
> arm: dts: add omap4460 thermal data
> arm: dts: add cooling properties on omap4430 cpu node
> arm: dts: add cooling properties on omap4460 cpu node
> arm: dts: add omap5 GPU thermal data
> arm: dts: add omap5 CORE thermal data
> arm: dts: add omap5 thermal data
> arm: dts: add cooling properties on omap5 cpu node
> arm: dts: make OMAP443x bandgap node to belong to OCP
> arm: dts: make OMAP4460 bandgap node to belong to OCP
> MAINTAINERS: add thermal bindings entry in thermal domain
>
> .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 +
> .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++
> MAINTAINERS | 1 +
> arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 +
> arch/arm/boot/dts/omap443x.dtsi | 23 +-
> arch/arm/boot/dts/omap4460.dtsi | 29 +-
> arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5.dtsi | 15 +-
> drivers/cpufreq/Kconfig | 2 +-
> drivers/cpufreq/cpufreq-cpu0.c | 16 +
> drivers/hwmon/lm75.c | 35 +-
> drivers/hwmon/tmp102.c | 19 +
> drivers/thermal/Kconfig | 14 +
> drivers/thermal/Makefile | 1 +
> drivers/thermal/cpu_cooling.c | 56 +-
> drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++
> drivers/thermal/thermal_core.c | 77 +-
> drivers/thermal/thermal_core.h | 9 +
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +-
> include/dt-bindings/thermal/thermal.h | 17 +
> include/linux/cpu_cooling.h | 25 +
> include/linux/thermal.h | 32 +-
> 23 files changed, 1939 insertions(+), 51 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
> create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
> create mode 100644 drivers/thermal/of-thermal.c
> create mode 100644 include/dt-bindings/thermal/thermal.h
> --
> To unsubscribe from this list: send the line "unsubscribe linux-pm" in
> the body of a message to majordomo@vger.kernel.org
> More majordomo info at http://vger.kernel.org/majordomo-info.html
>
>
--
You have got to be excited about what you are doing. (L. Lamport)
Eduardo Valentin
[-- Attachment #2: OpenPGP digital signature --]
[-- Type: application/pgp-signature, Size: 295 bytes --]
next prev parent reply other threads:[~2013-11-25 15:51 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2013-11-25 14:44 [GIT PULL] Thermal and Device tree Eduardo Valentin
2013-11-25 14:44 ` Eduardo Valentin
2013-11-25 14:44 ` [lm-sensors] " Eduardo Valentin
[not found] ` <1385390669-7613-1-git-send-email-eduardo.valentin-l0cyMroinI0@public.gmane.org>
2013-11-25 15:51 ` Eduardo Valentin [this message]
2013-11-25 15:51 ` Eduardo Valentin
2013-11-25 15:51 ` [lm-sensors] " Eduardo Valentin
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