From: kongxinwei <kong.kongxinwei@hisilicon.com>
To: Mark Rutland <mark.rutland@arm.com>
Cc: "rui.zhuang@intel.com" <rui.zhuang@intel.com>,
"edubezval@gmail.com" <edubezval@gmail.com>,
"linux-pm@vger.kernel.org" <linux-pm@vger.kernel.org>,
"linux-kernel@vger.kernel.org" <linux-kernel@vger.kernel.org>,
"linux-arm-kernel@lists.infradead.org"
<linux-arm-kernel@lists.infradead.org>,
"linuxarm@huawei.com" <linuxarm@huawei.com>,
"devicetree@vger.kernel.org" <devicetree@vger.kernel.org>,
"liguozhu@hisilicon.com" <liguozhu@hisilicon.com>,
"xuwei5@hisilicon.com" <xuwei5@hisilicon.com>
Subject: Re: [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver
Date: Fri, 20 Mar 2015 15:37:24 +0800 [thread overview]
Message-ID: <550BCE34.9010904@hisilicon.com> (raw)
In-Reply-To: <20150319141753.GB25967@leverpostej>
在 2015/3/19 22:17, Mark Rutland 写道:
> On Thu, Mar 19, 2015 at 07:57:27AM +0000, kongxinwei wrote:
>> This patch adds the support for hisilicon thermal sensor, within
>> hisilicon SoC. there will register sensors for thermal framework
>> and use device tree to bind cooling device.
>>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>> ---
>> drivers/thermal/Kconfig | 8 +
>> drivers/thermal/Makefile | 1 +
>> drivers/thermal/hisi_thermal.c | 531 +++++++++++++++++++++++++++++++++++++++++
>> 3 files changed, 540 insertions(+)
>> create mode 100644 drivers/thermal/hisi_thermal.c
>
> [...]
>
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-lag-value",
>> + &sensor->lag);
>
> This wasn't in the binding.
>
good comment, delete it.
Xinwei
> [...]
>
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-thres-temp",
>> + &sensor->thres_temp);
>> + if (ret) {
>> + dev_err(&pdev->dev, "failed to get thres value %d: %d\n",
>> + index, ret);
>> + return ret;
>> + }
>> +
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-reset-temp",
>> + &sensor->reset_temp);
>> + if (ret) {
>> + dev_err(&pdev->dev, "failed to get reset value %d: %d\n",
>> + index, ret);
>> + return ret;
>> + }
>
> I see now that these properties result in the HW being programmed. You
> should figure out how to reconcile these with thermal-zone trip points
> rather than having parallel properties.
>
oh,firstly,this "tsensor-thres-temp" property is threshold temperature value
which causes interrupt function by setting thermal value register. "thermal
-zone trip points" applies scanning mode to cause other function such as
cooling freq .., but this "tsensor-thres-temp" property be used by interrupt
mode. when scanning mode don't satisfies systerm demands, the interrut mode
perfectly help scanning mode to complete function. "tsensor-thres-temp" temp-
erature is higher than "thermal-zone trip points" temperature, so this "
tsensor-thres-temp" property is secondary attribute.
secondly, this "tsensor-reset-temp" property is hardware protect temperature
which is close to or is below to burn out the SoC. When SoC temperature is
"tsensor-reset-temp" temperature value, SoC will be force to reboot and ensure
SoC not to burn out. So it don't conflict thermal-zone.
>> +
>> + if (of_property_read_bool(np, "hisilicon,tsensor-bind-irq")) {
>> +
>> + if (data->irq_bind_sensor != -1)
>> + dev_warn(&pdev->dev, "irq has bound to index %d\n",
>> + data->irq_bind_sensor);
>> +
>> + /* bind irq to this sensor */
>> + data->irq_bind_sensor = index;
>> + }
>
> I don't see why this should be specified in the DT. Why do you believe
> it should?
>
SoC include foure thermal sensor modules,every modules is able to cause
interrupt,so binding a module to realize interupt function and i believe
it should be specified.
> [...]
>
>> +static int hisi_thermal_probe(struct platform_device *pdev)
>> +{
>> + struct hisi_thermal_data *data;
>> + struct resource *res;
>> + int i;
>> + int ret;
>> +
>> + if (!cpufreq_get_current_driver()) {
>> + dev_dbg(&pdev->dev, "no cpufreq driver!");
>> + return -EPROBE_DEFER;
>> + }
>
> Surely we care about not burning out the board even if we don't have
> cpufreq?
>
> Is there any ordering guarantee between the probing of this driver and
> cpufreq?
>
>
Yes! It will use thermal framework to realize cpu cooling device function.
> [...]
>
>> + data->clk = devm_clk_get(&pdev->dev, NULL);
>
> You gave this clock a name in the binding. Use it or drop it.
>
Thanks comment,use it.
> Mark.
>
Xinwei
> .
>
WARNING: multiple messages have this Message-ID (diff)
From: kong.kongxinwei@hisilicon.com (kongxinwei)
To: linux-arm-kernel@lists.infradead.org
Subject: [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver
Date: Fri, 20 Mar 2015 15:37:24 +0800 [thread overview]
Message-ID: <550BCE34.9010904@hisilicon.com> (raw)
In-Reply-To: <20150319141753.GB25967@leverpostej>
? 2015/3/19 22:17, Mark Rutland ??:
> On Thu, Mar 19, 2015 at 07:57:27AM +0000, kongxinwei wrote:
>> This patch adds the support for hisilicon thermal sensor, within
>> hisilicon SoC. there will register sensors for thermal framework
>> and use device tree to bind cooling device.
>>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>> ---
>> drivers/thermal/Kconfig | 8 +
>> drivers/thermal/Makefile | 1 +
>> drivers/thermal/hisi_thermal.c | 531 +++++++++++++++++++++++++++++++++++++++++
>> 3 files changed, 540 insertions(+)
>> create mode 100644 drivers/thermal/hisi_thermal.c
>
> [...]
>
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-lag-value",
>> + &sensor->lag);
>
> This wasn't in the binding.
>
good comment, delete it.
Xinwei
> [...]
>
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-thres-temp",
>> + &sensor->thres_temp);
>> + if (ret) {
>> + dev_err(&pdev->dev, "failed to get thres value %d: %d\n",
>> + index, ret);
>> + return ret;
>> + }
>> +
>> + ret = of_property_read_u32(np, "hisilicon,tsensor-reset-temp",
>> + &sensor->reset_temp);
>> + if (ret) {
>> + dev_err(&pdev->dev, "failed to get reset value %d: %d\n",
>> + index, ret);
>> + return ret;
>> + }
>
> I see now that these properties result in the HW being programmed. You
> should figure out how to reconcile these with thermal-zone trip points
> rather than having parallel properties.
>
oh,firstly,this "tsensor-thres-temp" property is threshold temperature value
which causes interrupt function by setting thermal value register. "thermal
-zone trip points" applies scanning mode to cause other function such as
cooling freq .., but this "tsensor-thres-temp" property be used by interrupt
mode. when scanning mode don't satisfies systerm demands, the interrut mode
perfectly help scanning mode to complete function. "tsensor-thres-temp" temp-
erature is higher than "thermal-zone trip points" temperature, so this "
tsensor-thres-temp" property is secondary attribute.
secondly, this "tsensor-reset-temp" property is hardware protect temperature
which is close to or is below to burn out the SoC. When SoC temperature is
"tsensor-reset-temp" temperature value, SoC will be force to reboot and ensure
SoC not to burn out. So it don't conflict thermal-zone.
>> +
>> + if (of_property_read_bool(np, "hisilicon,tsensor-bind-irq")) {
>> +
>> + if (data->irq_bind_sensor != -1)
>> + dev_warn(&pdev->dev, "irq has bound to index %d\n",
>> + data->irq_bind_sensor);
>> +
>> + /* bind irq to this sensor */
>> + data->irq_bind_sensor = index;
>> + }
>
> I don't see why this should be specified in the DT. Why do you believe
> it should?
>
SoC include foure thermal sensor modules,every modules is able to cause
interrupt,so binding a module to realize interupt function and i believe
it should be specified.
> [...]
>
>> +static int hisi_thermal_probe(struct platform_device *pdev)
>> +{
>> + struct hisi_thermal_data *data;
>> + struct resource *res;
>> + int i;
>> + int ret;
>> +
>> + if (!cpufreq_get_current_driver()) {
>> + dev_dbg(&pdev->dev, "no cpufreq driver!");
>> + return -EPROBE_DEFER;
>> + }
>
> Surely we care about not burning out the board even if we don't have
> cpufreq?
>
> Is there any ordering guarantee between the probing of this driver and
> cpufreq?
>
>
Yes! It will use thermal framework to realize cpu cooling device function.
> [...]
>
>> + data->clk = devm_clk_get(&pdev->dev, NULL);
>
> You gave this clock a name in the binding. Use it or drop it.
>
Thanks comment,use it.
> Mark.
>
Xinwei
> .
>
next prev parent reply other threads:[~2015-03-20 7:37 UTC|newest]
Thread overview: 44+ messages / expand[flat|nested] mbox.gz Atom feed top
2015-03-19 7:57 [PATCH 0/3] 96boards: add thermal senor support to hikey board kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 14:17 ` Mark Rutland
2015-03-19 14:17 ` Mark Rutland
2015-03-20 6:06 ` Leo Yan
2015-03-20 6:06 ` Leo Yan
2015-03-20 11:24 ` Mark Rutland
2015-03-20 11:24 ` Mark Rutland
2015-03-20 11:24 ` Mark Rutland
2015-03-20 14:53 ` Leo Yan
2015-03-20 14:53 ` Leo Yan
2015-03-20 15:55 ` Mark Rutland
2015-03-20 15:55 ` Mark Rutland
2015-03-23 4:46 ` Leo Yan
2015-03-23 4:46 ` Leo Yan
2015-03-23 8:30 ` kongxinwei
2015-03-23 8:30 ` kongxinwei
2015-03-20 15:27 ` Xinwei Kong
2015-03-20 15:27 ` Xinwei Kong
2015-03-20 15:27 ` Xinwei Kong
2015-03-20 7:37 ` kongxinwei [this message]
2015-03-20 7:37 ` kongxinwei
2015-03-19 7:57 ` [PATCH 2/3] dts: hi6220: enable thermal sensor for hisilicon SoC kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` [PATCH 3/3] dt-bindings: Document the hi6220 thermal sensor bindings kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 7:57 ` kongxinwei
2015-03-19 14:08 ` Mark Rutland
2015-03-19 14:08 ` Mark Rutland
2015-03-19 13:59 ` [PATCH 0/3] 96boards: add thermal senor support to hikey board Mark Rutland
2015-03-19 13:59 ` Mark Rutland
2015-03-20 3:10 ` kongxinwei
2015-03-20 3:10 ` kongxinwei
2015-03-20 3:10 ` kongxinwei
2015-03-20 6:13 ` Leo Yan
2015-03-20 6:13 ` Leo Yan
2015-03-20 7:41 ` kongxinwei
2015-03-20 7:41 ` kongxinwei
2015-03-20 7:41 ` kongxinwei
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=550BCE34.9010904@hisilicon.com \
--to=kong.kongxinwei@hisilicon.com \
--cc=devicetree@vger.kernel.org \
--cc=edubezval@gmail.com \
--cc=liguozhu@hisilicon.com \
--cc=linux-arm-kernel@lists.infradead.org \
--cc=linux-kernel@vger.kernel.org \
--cc=linux-pm@vger.kernel.org \
--cc=linuxarm@huawei.com \
--cc=mark.rutland@arm.com \
--cc=rui.zhuang@intel.com \
--cc=xuwei5@hisilicon.com \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is an external index of several public inboxes,
see mirroring instructions on how to clone and mirror
all data and code used by this external index.