[PATCH 0/3] Update for AP807 thermal data

From: "Russell King (Oracle)" <linux@armlinux.org.uk>
To: Amit Kucheria <amitk@kernel.org>, Andrew Lunn <andrew@lunn.ch>,
	Daniel Lezcano <daniel.lezcano@linaro.org>,
	Gregory Clement <gregory.clement@bootlin.com>,
	Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
	Miquel Raynal <miquel.raynal@bootlin.com>,
	"Rafael J. Wysocki" <rafael@kernel.org>,
	Rob Herring <robh+dt@kernel.org>,
	Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>,
	Zhang Rui <rui.zhang@intel.com>
Cc: devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org,
	linux-pm@vger.kernel.org
Subject: [PATCH 0/3] Update for AP807 thermal data
Date: Fri, 16 Jun 2023 12:49:53 +0100	[thread overview]
Message-ID: <ZIxMYXDCTB7IvsDk@shell.armlinux.org.uk> (raw)

Hi,

This series updates the thermal data for the AP807 die, which has
different coefficients to the AP806.

These patches have come from the SolidRun CN913x build repository
which can be found at:
https://github.com/SolidRun/cn913x_build/tree/master/patches/linux

 .../devicetree/bindings/thermal/armada-thermal.txt |  1 +
 arch/arm64/boot/dts/marvell/armada-ap807.dtsi      |  3 ++
 drivers/thermal/armada_thermal.c                   | 32 ++++++++++++++++++++--
 3 files changed, 34 insertions(+), 2 deletions(-)

-- 
RMK's Patch system: https://www.armlinux.org.uk/developer/patches/
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