From: bugzilla@dpdk.org
To: dev@dpdk.org
Subject: [DPDK/ethdev Bug 1699] Bonding device documentation missing
Date: Sat, 24 Jan 2026 20:23:10 +0000 [thread overview]
Message-ID: <bug-1699-3-0zlAM2rw1c@http.bugs.dpdk.org/> (raw)
In-Reply-To: <bug-1699-3@http.bugs.dpdk.org/>
http://bugs.dpdk.org/show_bug.cgi?id=1699
Stephen Hemminger (stephen@networkplumber.org) changed:
What |Removed |Added
----------------------------------------------------------------------------
Resolution|--- |INVALID
Status|UNCONFIRMED |RESOLVED
--- Comment #1 from Stephen Hemminger (stephen@networkplumber.org) ---
This NIC was dropped from table intentionally by:
commit 7b103c4ccd98e3f3d457c74960acd28dac64392d
Author: Thomas Monjalon <thomas@monjalon.net>
Date: Thu Mar 12 00:01:35 2020 +0100
doc: remove empty columns from NIC features matrix
The virtual PMDs bonding, KNI, null, ring, softnic and vdev_netvsc
have no real feature to advertise so they can be removed
from the (too) big matrix of ethdev features.
Signed-off-by: Thomas Monjalon <thomas@monjalon.net>
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prev parent reply other threads:[~2026-01-24 20:23 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2025-04-24 16:28 [DPDK/ethdev Bug 1699] Bonding device documentation missing bugzilla
2026-01-24 20:23 ` bugzilla [this message]
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