From: bugzilla@dpdk.org
To: dev@dpdk.org
Subject: [DPDK/ethdev Bug 1699] Bonding device documentation missing
Date: Thu, 24 Apr 2025 16:28:58 +0000 [thread overview]
Message-ID: <bug-1699-3@http.bugs.dpdk.org/> (raw)
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https://bugs.dpdk.org/show_bug.cgi?id=1699
Bug ID: 1699
Summary: Bonding device documentation missing
Product: DPDK
Version: 25.03
Hardware: All
OS: All
Status: UNCONFIRMED
Severity: minor
Priority: Normal
Component: ethdev
Assignee: dev@dpdk.org
Reporter: stephen@networkplumber.org
Target Milestone: ---
There is no entry in the PMD feature matrix for bonding device.
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next reply other threads:[~2025-04-24 16:29 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2025-04-24 16:28 bugzilla [this message]
2026-01-24 20:23 ` [DPDK/ethdev Bug 1699] Bonding device documentation missing bugzilla
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