From: Lee Jones <lee@kernel.org>
To: Binbin Zhou <zhoubb.aaron@gmail.com>,
Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Yinbo Zhu <zhuyinbo@loongson.cn>,
zhanghongchen <zhanghongchen@loongson.cn>,
"Rafael J . Wysocki" <rafael@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Lee Jones <lee@kernel.org>,
Huacai Chen <chenhuacai@kernel.org>,
Daniel Lezcano <daniel.lezcano@kernel.org>,
Binbin Zhou <zhoubinbin@loongson.cn>
Cc: Huacai Chen <chenhuacai@kernel.org>,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org,
mfd@lists.linux.dev
Subject: Re: (subset) [PATCH v4 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id
Date: Wed, 12 Aug 2026 12:25:42 +0100 [thread overview]
Message-ID: <178653394272.1364218.6326646131780320669.b4-ty@b4> (raw)
In-Reply-To: <b76405a88b0cded91ba370139d7223fe2d6953df.1785829933.git.zhoubinbin@loongson.cn>
On Tue, 04 Aug 2026 20:43:56 +0800, Binbin Zhou wrote:
> The Loongson-2K0300 SoC exposes its chip ID registers through a syscon
> interface. Add the specific compatible `loongson,ls2k0300-chipid-syscon`
> to the allowed list of syscon bindings so that it can be referenced from
> the thermal node via a phandle.
Applied, thanks!
[3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id
commit: 2b02aa1b547a57e1e7aad1364a57520cf4ac49cf
--
Lee Jones [李琼斯]
next prev parent reply other threads:[~2026-08-12 11:25 UTC|newest]
Thread overview: 15+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-08-04 12:40 [PATCH v4 0/5] thermal: loongson2: Add support for Loongson-2K0300 SoC Binbin Zhou
2026-08-04 12:42 ` [PATCH v4 1/5] thermal/drivers/loongson2: Correct thermal sensor registration loop Binbin Zhou
2026-08-04 13:01 ` sashiko-bot
2026-08-04 12:43 ` [PATCH v4 2/5] thermal/drivers/loongson2: Move thermal_ops to chip_data for SoC scalability Binbin Zhou
2026-08-04 12:55 ` sashiko-bot
2026-08-04 12:43 ` [PATCH v4 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id Binbin Zhou
2026-08-04 12:46 ` sashiko-bot
2026-08-05 6:59 ` Krzysztof Kozlowski
2026-08-12 11:25 ` Lee Jones [this message]
2026-08-04 12:43 ` [PATCH v4 4/5] dt-bindings: thermal: loongson,ls2k-thermal: Add compatible for Loongson-2K0300 Binbin Zhou
2026-08-04 12:49 ` sashiko-bot
2026-08-04 12:43 ` [PATCH v4 5/5] thermal/drivers/loongson2: Add support " Binbin Zhou
2026-08-04 12:59 ` sashiko-bot
2026-08-05 9:43 ` [PATCH v4 0/5] thermal: loongson2: Add support for Loongson-2K0300 SoC Huacai Chen
2026-09-04 2:14 ` Binbin Zhou
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