* [PATCH v2 12/12] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
[not found] <20260422174305.2899095-1-daniel.lezcano@oss.qualcomm.com>
@ 2026-04-22 17:43 ` Daniel Lezcano
2026-04-23 8:33 ` Krzysztof Kozlowski
0 siblings, 1 reply; 2+ messages in thread
From: Daniel Lezcano @ 2026-04-22 17:43 UTC (permalink / raw)
To: rafael, daniel.lezcano
Cc: gaurav.kohli, Zhang Rui, Lukasz Luba, Rob Herring,
Krzysztof Kozlowski, Conor Dooley, Lucas Stach, Russell King,
Christian Gmeiner, David Airlie, Simona Vetter, Guenter Roeck,
Joel Stanley, Andrew Jeffery, Thomas Weißschuh, Benson Leung,
Pali Rohár, Avi Fishman, Tomer Maimon, Tali Perry,
Patrick Venture, Nancy Yuen, Benjamin Fair, Heiko Stuebner,
Thierry Reding, Jonathan Hunter, Bjorn Andersson, Konrad Dybcio,
Amit Daniel Kachhap, Viresh Kumar, Neil Armstrong, Amit Kucheria,
linux-pm, linux-kernel, linux-hwmon,
open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS
From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Extend the thermal cooling device binding to support a 3 cells specifier
along with the 2 cells format.
Update #cooling-cells property to enum to support both 2 and 3 arguments.
Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
---
Documentation/devicetree/bindings/hwmon/pwm-fan.yaml | 3 ++-
.../bindings/thermal/thermal-cooling-devices.yaml | 8 ++++++--
.../devicetree/bindings/thermal/thermal-zones.yaml | 3 ++-
3 files changed, 10 insertions(+), 4 deletions(-)
diff --git a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
index a84cc3a4cfdc..6a24851fd80d 100644
--- a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
+++ b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
@@ -63,7 +63,8 @@ properties:
description: The PWM that is used to control the fan.
maxItems: 1
- "#cooling-cells": true
+ "#cooling-cells":
+ const: 2
required:
- compatible
diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
index b9022f1613d8..28f5818f1e60 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -44,10 +44,14 @@ select: true
properties:
"#cooling-cells":
description:
- Must be 2, in order to specify minimum and maximum cooling state used in
+ Must be 2 or 3. If 2, specifies minimum and maximum cooling state used in
the cooling-maps reference. The first cell is the minimum cooling state
and the second cell is the maximum cooling state requested.
- const: 2
+ If 3, the first cell specifies the thermal mitigation device specifier
+ index for devices that support multiple thermal mitigation mechanisms.
+ The two other cells are respectively the minimum cooling state and the
+ maximum cooling state.
+ enum: [2, 3]
additionalProperties: true
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
index 0de0a9757ccc..1261ba0e802e 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -214,7 +214,8 @@ patternProperties:
device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
cooling-device phandle limit specifier lets the framework
use the minimum and maximum cooling state for that cooling
- device automatically.
+ device automatically. If three arguments are specified,
+ the first argument is the cooling device specifier.
contribution:
$ref: /schemas/types.yaml#/definitions/uint32
--
2.43.0
^ permalink raw reply related [flat|nested] 2+ messages in thread
* Re: [PATCH v2 12/12] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
2026-04-22 17:43 ` [PATCH v2 12/12] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device Daniel Lezcano
@ 2026-04-23 8:33 ` Krzysztof Kozlowski
0 siblings, 0 replies; 2+ messages in thread
From: Krzysztof Kozlowski @ 2026-04-23 8:33 UTC (permalink / raw)
To: Daniel Lezcano
Cc: rafael, daniel.lezcano, gaurav.kohli, Zhang Rui, Lukasz Luba,
Rob Herring, Krzysztof Kozlowski, Conor Dooley, Lucas Stach,
Russell King, Christian Gmeiner, David Airlie, Simona Vetter,
Guenter Roeck, Joel Stanley, Andrew Jeffery,
Thomas Weißschuh, Benson Leung, Pali Rohár, Avi Fishman,
Tomer Maimon, Tali Perry, Patrick Venture, Nancy Yuen,
Benjamin Fair, Heiko Stuebner, Thierry Reding, Jonathan Hunter,
Bjorn Andersson, Konrad Dybcio, Amit Daniel Kachhap, Viresh Kumar,
Neil Armstrong, Amit Kucheria, linux-pm, linux-kernel,
linux-hwmon,
open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS
On Wed, Apr 22, 2026 at 07:43:01PM +0200, Daniel Lezcano wrote:
> From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>
> Extend the thermal cooling device binding to support a 3 cells specifier
> along with the 2 cells format.
>
> Update #cooling-cells property to enum to support both 2 and 3 arguments.
>
> Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'
>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Best regards,
Krzysztof
^ permalink raw reply [flat|nested] 2+ messages in thread
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2026-04-22 17:43 ` [PATCH v2 12/12] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device Daniel Lezcano
2026-04-23 8:33 ` Krzysztof Kozlowski
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