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From: Krzysztof Kozlowski <krzk@kernel.org>
To: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
Cc: Amit Kucheria <amitk@kernel.org>,
	 Thara Gopinath <thara.gopinath@gmail.com>,
	"Rafael J. Wysocki" <rafael@kernel.org>,
	 Daniel Lezcano <daniel.lezcano@kernel.org>,
	Zhang Rui <rui.zhang@intel.com>,
	 Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
	 Krzysztof Kozlowski <krzk+dt@kernel.org>,
	Conor Dooley <conor+dt@kernel.org>,
	linux-pm@vger.kernel.org,  linux-arm-msm@vger.kernel.org,
	devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
	 manaf.pallikunhi@oss.qualcomm.com,
	gaurav.kohli@oss.qualcomm.com
Subject: Re: [PATCH] dt-bindings: thermal: qcom-tsens: Document the Hawi Temperature Sensor
Date: Fri, 15 May 2026 11:01:19 +0200	[thread overview]
Message-ID: <20260515-complex-thoughtful-civet-89c06a@quoll> (raw)
In-Reply-To: <20260512-dtbinding-hawi-v1-1-96149d06cccf@oss.qualcomm.com>

On Tue, May 12, 2026 at 04:43:36PM +0530, Dipa Ramesh Mantre wrote:
> Document the Temperature Sensor (TSENS) on the Qualcomm Hawi SoC.
> 
> Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>

Best regards,
Krzysztof


      reply	other threads:[~2026-05-15  9:01 UTC|newest]

Thread overview: 2+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-05-12 11:13 [PATCH] dt-bindings: thermal: qcom-tsens: Document the Hawi Temperature Sensor Dipa Ramesh Mantre via B4 Relay
2026-05-15  9:01 ` Krzysztof Kozlowski [this message]

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