From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: dipa.mantre@oss.qualcomm.com, Amit Kucheria <amitk@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>
Cc: linux-pm@vger.kernel.org, linux-arm-msm@vger.kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
manaf.pallikunhi@oss.qualcomm.com, gaurav.kohli@oss.qualcomm.com
Subject: Re: [PATCH] dt-bindings: thermal: qcom-tsens: Document the Hawi Temperature Sensor
Date: Sun, 17 May 2026 17:04:25 +0200 [thread overview]
Message-ID: <3aaa5d3a-4aca-4c16-81a1-5afa17fd49d1@oss.qualcomm.com> (raw)
In-Reply-To: <20260512-dtbinding-hawi-v1-1-96149d06cccf@oss.qualcomm.com>
On 5/12/26 13:13, Dipa Ramesh Mantre via B4 Relay wrote:
> From: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
>
> Document the Temperature Sensor (TSENS) on the Qualcomm Hawi SoC.
>
> Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
> ---
Applied, thanks
prev parent reply other threads:[~2026-05-17 15:04 UTC|newest]
Thread overview: 3+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-05-12 11:13 [PATCH] dt-bindings: thermal: qcom-tsens: Document the Hawi Temperature Sensor Dipa Ramesh Mantre via B4 Relay
2026-05-15 9:01 ` Krzysztof Kozlowski
2026-05-17 15:04 ` Daniel Lezcano [this message]
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