* [PATCH 1/2] remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra
2026-07-14 6:00 [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP Dipa Ramesh Mantre
@ 2026-07-14 6:00 ` Dipa Ramesh Mantre
2026-07-14 6:00 ` [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP cooling Dipa Ramesh Mantre
2026-07-14 6:04 ` [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP Gaurav Kohli
2 siblings, 0 replies; 4+ messages in thread
From: Dipa Ramesh Mantre @ 2026-07-14 6:00 UTC (permalink / raw)
To: Bjorn Andersson, Mathieu Poirier, Konrad Dybcio, Rob Herring,
Krzysztof Kozlowski, Conor Dooley
Cc: linux-arm-msm, linux-remoteproc, linux-kernel, devicetree,
gaurav.kohli, Dipa Ramesh Mantre
Add QMI TMD instance IDs and cooling device name arrays for CDSP
on Shikra to enable thermal mitigation support.
Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
---
drivers/remoteproc/qcom_q6v5_pas.c | 3 +++
1 file changed, 3 insertions(+)
diff --git a/drivers/remoteproc/qcom_q6v5_pas.c b/drivers/remoteproc/qcom_q6v5_pas.c
index 60a4337d9e51..aa2add77b832 100644
--- a/drivers/remoteproc/qcom_q6v5_pas.c
+++ b/drivers/remoteproc/qcom_q6v5_pas.c
@@ -1537,6 +1537,9 @@ static const struct qcom_pas_data shikra_cdsp_resource = {
.sysmon_name = "cdsp",
.ssctl_id = 0x17,
.smem_host_id = 5,
+ .tmd_instance_id = 0x43,
+ .tmd_name = cdsp_tmd_name,
+ .num_tmd = ARRAY_SIZE(cdsp_tmd_name),
};
static const struct qcom_pas_data shikra_lpaicp_resource = {
--
2.34.1
^ permalink raw reply related [flat|nested] 4+ messages in thread* [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP cooling
2026-07-14 6:00 [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP Dipa Ramesh Mantre
2026-07-14 6:00 ` [PATCH 1/2] remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra Dipa Ramesh Mantre
@ 2026-07-14 6:00 ` Dipa Ramesh Mantre
2026-07-14 6:04 ` [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP Gaurav Kohli
2 siblings, 0 replies; 4+ messages in thread
From: Dipa Ramesh Mantre @ 2026-07-14 6:00 UTC (permalink / raw)
To: Bjorn Andersson, Mathieu Poirier, Konrad Dybcio, Rob Herring,
Krzysztof Kozlowski, Conor Dooley
Cc: linux-arm-msm, linux-remoteproc, linux-kernel, devicetree,
gaurav.kohli, Dipa Ramesh Mantre
Unlike the CPU, the CDSP does not throttle its speed automatically
when it reaches high temperatures in shikra.
Set up CDSP cooling by throttling the cdsp, when it reaches 115°C.
Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
---
arch/arm64/boot/dts/qcom/shikra.dtsi | 21 ++++++++++++++++++++-
1 file changed, 20 insertions(+), 1 deletion(-)
diff --git a/arch/arm64/boot/dts/qcom/shikra.dtsi b/arch/arm64/boot/dts/qcom/shikra.dtsi
index 2ab474f18af7..d54ac6ed6ab7 100644
--- a/arch/arm64/boot/dts/qcom/shikra.dtsi
+++ b/arch/arm64/boot/dts/qcom/shikra.dtsi
@@ -10,6 +10,7 @@
#include <dt-bindings/interconnect/qcom,icc.h>
#include <dt-bindings/interconnect/qcom,osm-l3.h>
#include <dt-bindings/dma/qcom-gpi.h>
+#include <dt-bindings/firmware/qcom,qmi-tmd.h>
#include <dt-bindings/interconnect/qcom,rpm-icc.h>
#include <dt-bindings/interconnect/qcom,shikra.h>
#include <dt-bindings/interrupt-controller/arm-gic.h>
@@ -1898,6 +1899,8 @@ remoteproc_cdsp: remoteproc@b300000 {
qcom,smem-states = <&cdsp_smp2p_out 0>;
qcom,smem-state-names = "stop";
+ #cooling-cells = <3>;
+
status = "disabled";
glink-edge {
@@ -2401,6 +2404,8 @@ gpuss-critical {
};
nsp-thermal {
+ polling-delay-passive = <200>;
+
thermal-sensors = <&tsens0 7>;
trips {
@@ -2410,12 +2415,26 @@ trip-point0 {
type = "hot";
};
- nsp-critical {
+ nsp_alert1: nsp-alert1 {
temperature = <115000>;
+ hysteresis = <5000>;
+ type = "passive";
+ };
+
+ nsp-critical {
+ temperature = <118000>;
hysteresis = <0>;
type = "critical";
};
};
+
+ cooling-maps {
+ map0 {
+ trip = <&nsp_alert1>;
+ cooling-device = <&remoteproc_cdsp QCOM_CDSP_TMD_CDSP_SW
+ THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
};
mdmss0-thermal {
--
2.34.1
^ permalink raw reply related [flat|nested] 4+ messages in thread* Re: [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP
2026-07-14 6:00 [PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP Dipa Ramesh Mantre
2026-07-14 6:00 ` [PATCH 1/2] remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra Dipa Ramesh Mantre
2026-07-14 6:00 ` [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP cooling Dipa Ramesh Mantre
@ 2026-07-14 6:04 ` Gaurav Kohli
2 siblings, 0 replies; 4+ messages in thread
From: Gaurav Kohli @ 2026-07-14 6:04 UTC (permalink / raw)
To: Dipa Ramesh Mantre, Bjorn Andersson, Mathieu Poirier,
Konrad Dybcio, Rob Herring, Krzysztof Kozlowski, Conor Dooley,
Daniel Lezcano
Cc: linux-arm-msm, linux-remoteproc, linux-kernel, devicetree
On 7/14/2026 11:30 AM, Dipa Ramesh Mantre wrote:
> Unlike CPUs, the CDSP does not automatically throttle based on thermal
> conditions. Enable CDSP thermal mitigation by adding Shikra CDSP cooling
> data to the Qualcomm PAS remoteproc driver and wiring the Shikra NSP
> thermal zone passive trip to the CDSP QMI TMD cooling device.
>
> Depends-on: https://lore.kernel.org/all/20260703-qmi-tmd-v4-0-3882189c1f83@oss.qualcomm.com/
Please wait, we will send v5 version of this series.
>
> Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
> ---
> Dipa Ramesh Mantre (2):
> remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra
> arm64: dts: qcom: shikra: Enable CDSP cooling
>
> arch/arm64/boot/dts/qcom/shikra.dtsi | 21 ++++++++++++++++++++-
> drivers/remoteproc/qcom_q6v5_pas.c | 3 +++
> 2 files changed, 23 insertions(+), 1 deletion(-)
> ---
> base-commit: 22f1a2f6953d5cc0a82845a69a23216158325d61
> change-id: 20260714-shikra-cdsp-5ec6ba6c51ce
> prerequisite-change-id: 20260609-qmi-tmd-383d30e1a60a:v4
> prerequisite-patch-id: 465c1f2dcefe2e2ffae3ca69296b6a9ec50ab830
> prerequisite-patch-id: 26c4e460ce1ef4866e140f38dd2c26509272d337
> prerequisite-patch-id: 4e76c812c7b98d649c57f5ace80cd42079cfe754
> prerequisite-patch-id: cbbdcc54de760873e4ba1a7788c14968ace935e2
> prerequisite-patch-id: 94d3ad39536d12a5623b148e15aa27ecf1abb209
> prerequisite-patch-id: bb184f20916f11fde0cb9b8b3fe7cf6344c58ae3
> prerequisite-patch-id: cb215c7070ab425fbe181785b831bc69a23e4078
> prerequisite-patch-id: 4fa886dd7f7c65daf1f22673adc35a527a84d609
> prerequisite-patch-id: b545487026c8f9b853c8b925b9fb097fb9987816
> prerequisite-patch-id: 4fcfdb3d75dd21f93880e70cceef9c883f9cd58e
> prerequisite-message-id: <20260703-qmi-tmd-v4-0-3882189c1f83@oss.qualcomm.com>
> prerequisite-patch-id: 465c1f2dcefe2e2ffae3ca69296b6a9ec50ab830
> prerequisite-patch-id: 26c4e460ce1ef4866e140f38dd2c26509272d337
> prerequisite-patch-id: 4e76c812c7b98d649c57f5ace80cd42079cfe754
> prerequisite-patch-id: cbbdcc54de760873e4ba1a7788c14968ace935e2
> prerequisite-patch-id: 94d3ad39536d12a5623b148e15aa27ecf1abb209
> prerequisite-patch-id: bb184f20916f11fde0cb9b8b3fe7cf6344c58ae3
> prerequisite-patch-id: cb215c7070ab425fbe181785b831bc69a23e4078
> prerequisite-patch-id: 4fa886dd7f7c65daf1f22673adc35a527a84d609
> prerequisite-patch-id: b545487026c8f9b853c8b925b9fb097fb9987816
> prerequisite-patch-id: 4fcfdb3d75dd21f93880e70cceef9c883f9cd58e
>
> Best regards,
^ permalink raw reply [flat|nested] 4+ messages in thread