Re: [PATCH v8 0/9] Add support for Qualcomm remoteproc subsystem cooling

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

Hi Bjorn, Mathieu,

Just wanted to kindly check if this series can be picked up.

Patch 1 has Krzysztof's Reviewed-by and Daniel's Acked-by, and the later
patches carry the review tags received in previous versions.

Please let me know if you would prefer any changes or a resend.

Thanks,
Gaurav


On 8/9/2026 5:58 PM, Gaurav Kohli wrote:
> This series introduces Qualcomm Messaging Interface based Thermal
> Mitigation Device (QMI TMD) support to control thermal mitigation
> on remote subsystems such as the Modem and CDSP.
> 
> The QMI TMD is an interface that instructs a remote subsystem to adjust
> the performance level of the devices it manages, reducing power consumption
> in response to critically low battery charge, overcurrent alerts, or
> overheating conditions.
> 
> The series is organized as follows:
> 
>   - Add a shared dt-bindings header mapping TMD device indices for use
>     in DT cooling-maps, ensuring a consistent binding between the thermal
>     zone and the QMI TMD driver.
> 
>   - Extend the remoteproc PAS binding with the optional #cooling-cells
>     property to allow remoteproc nodes to be referenced as cooling devices.
> 
>   - Add QMI TMD support in the remoteproc PAS framework, hooking into
>     the probe/unregister lifecycle to register and unregister cooling
>     devices with the thermal framework.
> 
>   - Enable CDSP and Modem cooling on kodiak, lemans, talos, monaco and
>     hamoa platforms using the new binding.
> 
> Not all TMD endpoints advertised by the firmware are wired into kernel
> thermal zones. Endpoints such as BCL (battery current limiting) and cold
> temperature protection are handled from userspace via qmi and do not
> require kernel thermal zone bindings.
> 
> The constants defined in this series cover only the endpoints actively
> used for thermal mitigation in the kernel thermal framework on the
> currently posted targets: cdsp_sw (CDSP software thermal limit), pa
> (modem power amplifier), and modem.
> 
> This work revives the earlier QMI cooling series by Casey Connolly [1],
> with the following key differences:
>   - Uses an id based API for cooling-device binding
>   - Integrates QMI TMD directly into the remoteproc PAS framework and
>     hooks into the probe/unregister lifecycle.
>   - Removes unused code and cleans up macro names
> 
> This series depends on cooling device id support from Daniel Lezcano [2].
> 
> [1] https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/
> [2] https://lore.kernel.org/all/20260526140802.1059293-12-daniel.lezcano@oss.qualcomm.com/
> 
> ---
> Changes in v8:
> - Added Reviewed-by tags from Abel and Krzysztof.
> - Return -ENOTCONN when QMI TMD is disconnected.
> - Use label references for Hamoa IoT NSP trip overrides. (Stephan)
> - Link to v7: https://lore.kernel.org/r/20260731-b4-qmi-tmd-v7-0-3befd44403d5@oss.qualcomm.com
> 
> Changes in v7:
> - Added Daniel's Acked-by/Reviewed-by tags.
> - Serialized cur_state update with QMI state request. (Sashiko)
> - Link to v6: https://lore.kernel.org/r/20260727-b4-qmi-tmd-v6-0-973cd3a226af@oss.qualcomm.com
> 
> Changes in v6:
> - Added Reviewed-by tags from Dmitry.
> - Kodiak: delete MPSS cooling maps by label on non-modem boards. (Dmitry)
> - Renamed qcom,qmi-tmd.h to qcom,pas.h. (Krzysztof)
> - Made QCOM_QMI_TMD tristate to fix unmet dependency issue. (Sashiko)
> - Removed redundant negative TMD id check in qcom_pas_setup_tmd(). (Dmitry)
> - Fixed QMI_DATA_LEN type issue by using u32. (Sashiko)
> - Link to v5: https://lore.kernel.org/r/20260721-b4-qmi-tmd-v5-0-99620e07f505@oss.qualcomm.com
> 
> Changes in v5:
> - Added Reviewed-by tag (Daniel Lezcano)
> - Squashed dt-bindings header patch into the yaml binding patch.(Krzysztof)
> - Renamed constants: QCOM_CDSP_TMD_CDSP_SW -> QCOM_TMD_CDSP_SW,
>    QCOM_MODEM_TMD_PA -> QCOM_TMD_PA, QCOM_MODEM_TMD_MODEM ->
>    QCOM_TMD_MODEM.(Krzysztof)
> - Replaced dev_err() with dev_err_probe() in qmi_tmd_init() (Krzysztof)
> - Fixed qmi_tmd_exit() teardown order to prevent cancel_work_sync()
>    re-queue race.(Krzysztof)
> - Removed only MPSS maps instead of entire cooling-maps node.(Dmitry)
> - Added cover letter note clarifying TMD endpoint selection rationale.(Dmitry)
> - Added NET dependency in Kconfig.(Julian)
> - Link to v4: https://lore.kernel.org/r/20260703-qmi-tmd-v4-0-3882189c1f83@oss.qualcomm.com
> 
> Changes in v4:
> - Drop the tmd-names DT property.
> - Move TMD instance id and tmd device name into PAS platform data.
> - Add a shared dt-bindings header to define numeric constant for TMD id.
> - Add mutex documentation comments for get/set state callbacks.
> - Link to v3: https://lore.kernel.org/r/20260609-qmi-tmd-v3-0-291a2ff4c634@oss.qualcomm.com
> 
> Changes in v3:
> - Removed the remoteproc-cooling abstraction approach.
> - Integerated QMI TMD with remoteproc core framework.
> - Cleaned the macro names and removed unused code.
> - Switched to index-based thermal_of_cooling_device_register() api.
> - Link to v2: https://lore.kernel.org/linux-devicetree/20260127155722.2797783-1-gaurav.kohli@oss.qualcomm.com/
> 
> Changes in v2:
> - Update Remoreproc thermal config to tristate and removed unnecessary NULL checks.
> - Fixed dt binding file format and added generic name support for cdsp.
> - Fixed memory leak and cleaned up qmi-cooling driver file.
> - Corrected DT formatting errors and commit descriptions for all targets.
> - Link to v1: https://lore.kernel.org/linux-devicetree/20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com/
> ---
> 
> ---
> Casey Connolly (1):
>        soc: qcom: Add QMI TMD support for remote thermal mitigation
> 
> Dipa Ramesh Mantre (1):
>        arm64: dts: qcom: hamoa: Enable CDSP cooling
> 
> Gaurav Kohli (7):
>        dt-bindings: remoteproc: qcom,pas: add #cooling-cells property
>        remoteproc: qcom: pas: add support for TMD thermal cooling devices
>        remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support
>        arm64: dts: qcom: kodiak: Enable CDSP & Modem cooling
>        arm64: dts: qcom: lemans: Enable CDSP cooling
>        arm64: dts: qcom: talos: Enable CDSP cooling
>        arm64: dts: qcom: monaco: Enable CDSP cooling
> 
>   .../bindings/remoteproc/qcom,pas-common.yaml       |   9 +
>   MAINTAINERS                                        |   8 +
>   arch/arm64/boot/dts/qcom/hamoa-iot-evk.dts         |  16 +
>   arch/arm64/boot/dts/qcom/hamoa.dtsi                |  63 +++
>   arch/arm64/boot/dts/qcom/kodiak.dtsi               | 125 +++++
>   arch/arm64/boot/dts/qcom/lemans.dtsi               | 125 ++++-
>   arch/arm64/boot/dts/qcom/monaco.dtsi               |  99 ++++
>   .../boot/dts/qcom/qcs6490-radxa-dragon-q6a.dts     |   8 +
>   .../dts/qcom/qcs6490-thundercomm-minipc-g1iot.dts  |   8 +
>   .../boot/dts/qcom/qcs6490-thundercomm-rubikpi3.dts |   8 +
>   .../boot/dts/qcom/qcs6490-vicharak-axon-mini.dts   |   8 +
>   .../boot/dts/qcom/sc7280-herobrine-lte-sku.dtsi    |  10 +
>   .../boot/dts/qcom/sc7280-herobrine-wifi-sku.dtsi   |   9 +
>   arch/arm64/boot/dts/qcom/talos.dtsi                |  19 +
>   drivers/remoteproc/Kconfig                         |   1 +
>   drivers/remoteproc/qcom_q6v5_pas.c                 | 117 +++-
>   drivers/soc/qcom/Kconfig                           |  12 +
>   drivers/soc/qcom/Makefile                          |   1 +
>   drivers/soc/qcom/qmi_tmd.c                         | 595 +++++++++++++++++++++
>   include/dt-bindings/thermal/qcom,pas.h             |  20 +
>   include/linux/soc/qcom/qmi.h                       |   1 +
>   include/linux/soc/qcom/qmi_tmd.h                   |  36 ++
>   22 files changed, 1285 insertions(+), 13 deletions(-)
> ---
> base-commit: 49362394dad7df66c274c867a271394c10ca2bb8
> change-id: 20260715-b4-qmi-tmd-d23e8df1b282
> 
> Best regards,