Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 7/3/2026 1:22 PM, Krzysztof Kozlowski wrote:
> On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote:
>> Add Device Tree binding constants for Qualcomm Thermal Mitigation
>> Device (TMD) types used by remoteproc-backed thermal cooling devices.
>>
>> Qualcomm remote processors expose thermal mitigation endpoints
>> through QMI. These endpoints can be registered with the thermal
>> framework via the `#cooling-cells` property on the remoteproc node.
>>
>> The QMI TMD protocol identifies devices using string names (for example,
>> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
>> `#cooling-cells = <3>` requires numeric device id in the form:
>>
>>    <&phandle device_id min_state max_state>
>>
>> Define common TMD device index constants shared across currently
>> supported platforms. If a future target requires a different mapping,
>> additional target-specific constants can be introduced while preserving
>> existing DT ABI.
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> ---
>>   MAINTAINERS                                 |  1 +
>>   include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
> 
> Why is it put into firmware? What part of firmware are you describing?
> To me it looks like thermal thing and even you wrote: Thermal Mitigation Device

Ack, it looks better under thermal. Will move to
include/dt-bindings/thermal/qcom,qmi-tmd.h in the next version.
> 
> Best regards,
> Krzysztof
>