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From: Jonathan Cameron <jic23@kernel.org>
To: Andrew Hepp <andrew.hepp@ahepp.dev>
Cc: linux-iio@vger.kernel.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH v2] iio: temperature: Add MCP9600 thermocouple EMF converter driver
Date: Sun, 5 Feb 2023 15:25:08 +0000	[thread overview]
Message-ID: <20230205152508.778b010a@jic23-huawei> (raw)
In-Reply-To: <20230112190551.4d9ac5f6@jic23-huawei>

On Thu, 12 Jan 2023 19:05:51 +0000
Jonathan Cameron <jic23@kernel.org> wrote:

> On Sun,  8 Jan 2023 15:45:04 -0800
> Andrew Hepp <andrew.hepp@ahepp.dev> wrote:
> 
> > From: "Andrew Hepp" <andrew.hepp@ahepp.dev>
> > 
> > Add support for the MCP9600 thermocouple EMF converter.
> > 
> > Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-Data-Sheet-20005426.pdf
> > Signed-off-by: Andrew Hepp <andrew.hepp@ahepp.dev>  
> 
> Driver looks good, but now I realise we don't have a device tree binding doc.
> 
> Please add one for v3.
> 
> Note that the binding doc is describing the hardware, not what the driver
> currently supports alone, so include the 4 (or 6?) interrupt lines (and interrupt-names
> as any random subset of them might be provided) + VDD regulator + anything else I've
> not noticed in my 10 second look at the datashet.

Hi Andrew,

If you aren't going to get to this sometime soon, feel free to say so and
I might write binding docs for it if I get time.  I'd rather do that than
lose a driver over some docs!

Jonathan

> 
> Thanks,
> 
> Jonathan
> 


  reply	other threads:[~2023-02-05 15:11 UTC|newest]

Thread overview: 4+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
     [not found] <Jonathan Cameron <jic23@kernel.org>
2023-01-08 23:45 ` [PATCH v2] iio: temperature: Add MCP9600 thermocouple EMF converter driver Andrew Hepp
2023-01-12 19:05   ` Jonathan Cameron
2023-02-05 15:25     ` Jonathan Cameron [this message]
2023-02-07  6:51       ` Andrew Hepp

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