From: Zhang Rui <rui.zhang@intel.com>
To: Thomas Gleixner <tglx@linutronix.de>, Len Brown <lenb@kernel.org>
Cc: x86@kernel.org, linux-kernel@vger.kernel.org,
Len Brown <len.brown@intel.com>,
linux-pm@vger.kernel.org
Subject: Re: [PATCH 08/14] powercap/intel_rapl: Support multi-die/package
Date: Mon, 08 Apr 2019 09:35:47 +0800 [thread overview]
Message-ID: <1554687347.2178.1.camel@intel.com> (raw)
In-Reply-To: <alpine.DEB.2.21.1904052022310.1802@nanos.tec.linutronix.de>
On 五, 2019-04-05 at 20:27 +0200, Thomas Gleixner wrote:
> On Tue, 26 Feb 2019, Len Brown wrote:
>
> >
> > From: Zhang Rui <rui.zhang@intel.com>
> >
> > On the new dual-die/package systems, the RAPL MSR becomes die-
> > scope.
> > Thus instead of one powercap device per physical package, now there
> > should be one powercap device for each unique die on these systems.
> >
> > This patch introduces intel_rapl driver support for new
> > dual-die/package systems.
> This patch .... See Documentation/processs/
>
> and this sentence is not really helpful either.
>
> >
> > On the hardwares that do not have multi-die,
> > topology_logical_die_id()
> > equals topology_physical_package_id(), thus there is no functional
> > change.
> Something like this:
>
> To support this the RAPL package domain has to be identified by the
> die id
> instead of the package id. On single die CPUs the die id is the same
> as the
> physical package id.
>
> Hmm?
Yeah, sounds much better.
Len, will you help me update the changelog or do you want me to send an
updated version to you?
thanks,
rui
>
> >
> > Signed-off-by: Zhang Rui <rui.zhang@intel.com>
> > Signed-off-by: Len Brown <len.brown@intel.com>
> > Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> > Cc: linux-pm@vger.kernel.org
> > ---
> > drivers/powercap/intel_rapl.c | 4 ++--
> > 1 file changed, 2 insertions(+), 2 deletions(-)
> >
> > diff --git a/drivers/powercap/intel_rapl.c
> > b/drivers/powercap/intel_rapl.c
> > index 6057d9695fed..8723e9ae7436 100644
> > --- a/drivers/powercap/intel_rapl.c
> > +++ b/drivers/powercap/intel_rapl.c
> > @@ -266,7 +266,7 @@ static struct rapl_domain
> > *platform_rapl_domain; /* Platform (PSys) domain */
> > /* caller to ensure CPU hotplug lock is held */
> > static struct rapl_package *rapl_find_package(int cpu)
> > {
> > - int id = topology_physical_package_id(cpu);
> > + int id = topology_logical_die_id(cpu);
> > struct rapl_package *rp;
> >
> > list_for_each_entry(rp, &rapl_packages, plist) {
> > @@ -1457,7 +1457,7 @@ static void rapl_remove_package(struct
> > rapl_package *rp)
> > /* called from CPU hotplug notifier, hotplug lock held */
> > static struct rapl_package *rapl_add_package(int cpu)
> > {
> > - int id = topology_physical_package_id(cpu);
> > + int id = topology_logical_die_id(cpu);
> > struct rapl_package *rp;
> > int ret;
> >
next prev parent reply other threads:[~2019-04-08 1:35 UTC|newest]
Thread overview: 10+ messages / expand[flat|nested] mbox.gz Atom feed top
[not found] <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com>
2019-02-26 6:20 ` [PATCH 07/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-02-26 19:06 ` Peter Zijlstra
2019-03-26 18:27 ` Len Brown
2019-02-26 6:20 ` [PATCH 08/14] powercap/intel_rapl: Support multi-die/package Len Brown
2019-04-05 18:27 ` Thomas Gleixner
2019-04-05 18:27 ` Thomas Gleixner
2019-04-08 1:35 ` Zhang Rui [this message]
2019-04-08 1:35 ` Zhang Rui
2019-02-26 6:20 ` [PATCH 10/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-26 6:20 ` [PATCH 11/14] hwmon/coretemp: Support multi-die/package Len Brown
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