From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: daniel.lezcano@oss.qualcomm.com, lukasz.luba@arm.com, rafael@kernel.org
Cc: rui.zhang@intel.com, linux-pm@vger.kernel.org,
linux-kernel@vger.kernel.org
Subject: [PATCH 1/4] thermal/core: Add dedicated release callback for cooling devices
Date: Fri, 8 May 2026 20:05:08 +0200 [thread overview]
Message-ID: <20260508180511.1306659-2-daniel.lezcano@oss.qualcomm.com> (raw)
In-Reply-To: <20260508180511.1306659-1-daniel.lezcano@oss.qualcomm.com>
The thermal class release callback currently handles both thermal
zones and cooling devices by checking the device name prefix.
Move the cooling device cleanup to a dedicated struct device release
callback. This avoids relying on device names to select the release
path and keeps the cooling device lifetime handling local to the
cooling device object.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
---
drivers/thermal/thermal_core.c | 19 +++++++++++--------
1 file changed, 11 insertions(+), 8 deletions(-)
diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c
index 2f4e2dc46b8f..cf5d4a9c11fe 100644
--- a/drivers/thermal/thermal_core.c
+++ b/drivers/thermal/thermal_core.c
@@ -952,7 +952,6 @@ static void thermal_unbind_cdev_from_trip(struct thermal_zone_device *tz,
static void thermal_release(struct device *dev)
{
struct thermal_zone_device *tz;
- struct thermal_cooling_device *cdev;
if (!strncmp(dev_name(dev), "thermal_zone",
sizeof("thermal_zone") - 1)) {
@@ -962,13 +961,6 @@ static void thermal_release(struct device *dev)
ida_destroy(&tz->ida);
mutex_destroy(&tz->lock);
complete(&tz->removal);
- } else if (!strncmp(dev_name(dev), "cooling_device",
- sizeof("cooling_device") - 1)) {
- cdev = to_cooling_device(dev);
- thermal_cooling_device_destroy_sysfs(cdev);
- kfree_const(cdev->type);
- ida_free(&thermal_cdev_ida, cdev->id);
- kfree(cdev);
}
}
@@ -1040,6 +1032,16 @@ static void thermal_cooling_device_init_complete(struct thermal_cooling_device *
thermal_zone_cdev_bind(tz, cdev);
}
+static void thermal_cdev_release(struct device *dev)
+{
+ struct thermal_cooling_device *cdev = to_cooling_device(dev);
+
+ thermal_cooling_device_destroy_sysfs(cdev);
+ kfree_const(cdev->type);
+ ida_free(&thermal_cdev_ida, cdev->id);
+ kfree(cdev);
+}
+
/**
* __thermal_cooling_device_register() - register a new thermal cooling device
* @np: a pointer to a device tree node.
@@ -1093,6 +1095,7 @@ __thermal_cooling_device_register(struct device_node *np,
cdev->ops = ops;
cdev->updated = false;
cdev->device.class = &thermal_class;
+ cdev->device.release = thermal_cdev_release;
cdev->devdata = devdata;
ret = cdev->ops->get_max_state(cdev, &cdev->max_state);
--
2.43.0
next prev parent reply other threads:[~2026-05-08 18:05 UTC|newest]
Thread overview: 10+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-05-08 18:05 [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev Daniel Lezcano
2026-05-08 18:05 ` Daniel Lezcano [this message]
2026-05-08 18:05 ` [PATCH 2/4] thermal/core: Add dedicated release callback for thermal zones Daniel Lezcano
2026-05-08 18:05 ` [PATCH 3/4] thermal/core: Allocate the thermal class dynamically Daniel Lezcano
2026-05-08 18:24 ` Rafael J. Wysocki
2026-05-08 19:22 ` Daniel Lezcano
2026-05-08 19:26 ` Rafael J. Wysocki
2026-05-08 19:28 ` Daniel Lezcano
2026-05-08 18:05 ` [PATCH 4/4] thermal/core: Use the thermal class pointer as init guard Daniel Lezcano
2026-05-08 18:10 ` [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev Daniel Lezcano
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