Re: [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 5/8/26 20:05, Daniel Lezcano wrote:
> This series cleans up the lifetime handling of thermal devices.
> 
> Currently, the thermal class release callback handles both thermal
> zones and cooling devices by checking the device name prefix. This
> approach is fragile and mixes responsibilities across different object
> types.
> 
> The first two patches introduce dedicated struct device release
> callbacks for thermal zones and cooling devices. This removes the need
> to rely on device names and keeps the lifetime management local to
> each object.
> 
> The last two patches convert the thermal class to a dynamically
> allocated object and simplify the initialization logic by using the
> class pointer itself as a guard instead of a separate boolean flag.
> 
> Overall, this results in a clearer separation of responsibilities and
> more robust lifetime management aligned with the device model.
> 
> No functional change intended.
Unless I’m mistaken, the patch sent to split the cooling device 
registration is correct with this cleanup.