From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Lukasz Luba <lukasz.luba@arm.com>
Cc: Thierry Reding <thierry.reding@gmail.com>,
rafael@kernel.org, Amit Kucheria <amitk@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
"open list:THERMAL" <linux-pm@vger.kernel.org>,
open list <linux-kernel@vger.kernel.org>
Subject: Re: [PATCH 1/2] thermal/core: Hardening the self-encapsulation
Date: Thu, 12 Oct 2023 15:14:23 +0200 [thread overview]
Message-ID: <d9f3bd7b-a5db-4d37-bb1f-f97e40c8a63a@linaro.org> (raw)
In-Reply-To: <a6b51de7-4f56-4db9-a7dd-60555ac6c37f@arm.com>
Hi Lukasz,
On 12/10/2023 14:01, Lukasz Luba wrote:
> Hi Daniel,
>
> On 10/12/23 11:26, Daniel Lezcano wrote:
>> The thermal private header has leaked all around the drivers which
>> interacted with the core internals. The thermal zone structure which
>> was part of the exported header led also to a leakage of the fields
>> into the different drivers, making very difficult to improve the core
>> code without having to change the drivers.
>>
>> Now we mostly fixed how the thermal drivers were interacting with the
>> thermal zones (actually fixed how they should not interact). The
>> thermal zone structure will be moved to the private thermal core
>> header. This header has been removed from the different drivers and
>> must belong to the core code only. In order to prevent this private
>> header to be included again in the drivers, make explicit only the
>> core code can include this header by defining a THERMAL_CORE_SUBSYS
>> macro. The private header will contain a check against this macro.
>>
>> The Tegra SoCtherm driver needs to access thermal_core.h to have the
>> get_thermal_instance() function definition. It is the only one
>> remaining driver which need to access the thermal_core.h header, so
>> the check will emit a warning at compilation time.
>>
>> Thierry Reding is reworking the driver to get rid of this function [1]
>> and thus when the changes will be merged, the compilation warning will
>> be converted to a compilation error, closing definitively the door to
>> the drivers willing to play with the thermal zone device internals.
>
> That looks like a good idea. Although, shouldn't we avoid the
> compilation warnings and just first merge the fixes for drivers?
Yes, we should but there is the series for nvidia (pointed in the
changelog) which need a slight refresh for the bindings AFAIR. That
series is since March 2023 and Thierry seems busy [1]. I'm holding the
hardening since then.
So I don't know how to make progress on this? I was assuming we can
merge this series and let the compiler recall what has to be fixed.
[1] https://lore.kernel.org/all/ZK14edZUih1kH_sZ@orome/
and as soon as it is fixed, we convert the WARNING to ERROR :P
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next prev parent reply other threads:[~2023-10-12 13:14 UTC|newest]
Thread overview: 10+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-10-12 10:26 [PATCH 1/2] thermal/core: Hardening the self-encapsulation Daniel Lezcano
2023-10-12 10:26 ` [PATCH 2/2] thermal/core: Reorder the headers inclusion Daniel Lezcano
2023-10-13 8:05 ` Lukasz Luba
2023-10-12 12:01 ` [PATCH 1/2] thermal/core: Hardening the self-encapsulation Lukasz Luba
2023-10-12 13:14 ` Daniel Lezcano [this message]
2023-10-12 14:30 ` Thierry Reding
2023-10-12 17:44 ` Rafael J. Wysocki
2023-10-12 21:13 ` Daniel Lezcano
2023-10-13 9:43 ` Rafael J. Wysocki
2023-10-13 8:03 ` Lukasz Luba
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