Re: [PATCH v6 0/4] thermal: k3: Add support for bandgap sensors

[Tero Kristo <t-kristo@ti.com>]

On 09/04/2020 17:07, J, KEERTHY wrote:
> 
> 
> On 4/9/2020 7:19 PM, Daniel Lezcano wrote:
>>
>> Hi Keerthy,
>>
>> On 07/04/2020 07:51, Keerthy wrote:
>>> Add VTM thermal support. In the Voltage Thermal
>>> Management Module(VTM), K3 AM654 supplies a voltage
>>> reference and a temperature sensor feature that are gathered in the band
>>> gap voltage and temperature sensor (VBGAPTS) module. The band
>>> gap provides current and voltage reference for its internal
>>> circuits and other analog IP blocks. The analog-to-digital
>>> converter (ADC) produces an output value that is proportional
>>> to the silicon temperature.
>>>
>>> Add support for bandgap sensors. Currently reading temperatures
>>> is supported.
>>
>> How do you want to proceed? Shall I take patches 1 & 2 ?
> 
> +Tero
> 
> Hi Tero,
> 
> Can you pull 3 & 4? Or Daniel can take all 4?

Let me pull the DT patches, that way we avoid any conflicts in the 
arm64/dts tree. There has been quite a bit of traffic on that front 
lately and we did mess up something with the current merge window already.

I believe you are picking the driver side changes to 5.8?

-Tero

> 
> - Keerthy
> 
>>
>>
>>> Changes in v6:
>>>
>>>    * Removed bunch of unused #defines and couple of redundant variables.
>>>    * Reordered patches a bit.
>>>    * Minor reordering in dt binding patch.
>>>
>>> Changes in v5:
>>>
>>>    * Removed thermal work function which was unused.
>>>    * Removed unused preve_tenmp and a couple more struct variables.
>>>    * Removed couple of redundant header function include.
>>>
>>> Changes in v4:
>>>
>>>    * Fixed comments from Daniel to remove trend function.
>>>    * Mostly cleaned up all the unused variables.
>>>    * Driver from bool to tristate.
>>>
>>> Changes in v3:
>>>
>>>    * Fixed errors seen with:
>>>      dt_binding_check 
>>> DT_SCHEMA_FILES=Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml 
>>>
>>>
>>> Changes in v2:
>>>
>>>    * Fixed yaml errors
>>>    * renamed am654-industrial-thermal.dtsi to 
>>> k3-am654-industrial-thermal.dtsi
>>>      to follow the convention for k3 family.
>>>
>>> Keerthy (4):
>>>    dt-bindings: thermal: k3: Add VTM bindings documentation
>>>    thermal: k3: Add support for bandgap sensors
>>>    arm64: dts: ti: am65-wakeup: Add VTM node
>>>    arm64: dts: ti: am654: Add thermal zones
>>>
>>>   .../bindings/thermal/ti,am654-thermal.yaml    |  56 ++++
>>>   arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi    |  11 +
>>>   .../dts/ti/k3-am654-industrial-thermal.dtsi   |  45 +++
>>>   drivers/thermal/Kconfig                       |  10 +
>>>   drivers/thermal/Makefile                      |   1 +
>>>   drivers/thermal/k3_bandgap.c                  | 264 ++++++++++++++++++
>>>   6 files changed, 387 insertions(+)
>>>   create mode 100644 
>>> Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>>   create mode 100644 
>>> arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
>>>   create mode 100644 drivers/thermal/k3_bandgap.c
>>>
>>
>>

--
Texas Instruments Finland Oy, Porkkalankatu 22, 00180 Helsinki. Y-tunnus/Business ID: 0615521-4. Kotipaikka/Domicile: Helsinki