Re: [PATCH 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

[Selvarasu Ganesan <selvarasu.g@samsung.com>]

On 9/7/2026 12:37 PM, Krzysztof Kozlowski wrote:
> On 07/09/2026 08:04, Selvarasu Ganesan wrote:
>> On 9/5/2026 12:52 PM, Krzysztof Kozlowski wrote:
>>> On 03/09/2026 09:12, Selvarasu Ganesan wrote:
>>>> The Samsung Exynos8855 USB glue is not separate from the Synopsys DWC3
>>>> core, using a flattened model where the DWC3 controller is directly
>>>> addressable rather than nested as a child node of a glue layer.
>>>>
>>>> Describe the Exynos USB block as a single node, referencing the split
>>>> out Synopsys DWC3 core properties via snps,dwc3-common.yaml. The new
>>>> binding follows the same approach as qcom,snps-dwc3.
>>>>
>>>> A generic fallback compatible "samsung,snps-dwc3" is introduced to
>>>> describe this binding, selected by the validator based on the presence
>>>> of the fallback string in the compatible list. Future Exynos SoCs
>>> This is AI slop text. Over longish useless sentence describing diff
>>> without actual information WHY.
>>>
>>> Don't send AI generated slop messages.
>> Sorry for the misleading info on this commit message. We were trying to
>> explain why a separate flattened representation is being introduced with
>> using generic fallback string, and follow the style of some other DWC3
>> flattened refactors (like the Qualcomm :
>> https://lore.kernel.org/all/20250414-dwc3-refactor-v7-2-f015b358722d@oss.qualcomm.com)
>> to justify the separate binding, but it became too long. We'll simplify
>> it and keep only the technical reasoning.
> Flattened node is the right approach, so just say this is the first
> Samsung Exynos binding using flattened node.


Thanks for your update.
We will update the commit message as follows and post a new patch set.
And We are assuming that all other points including the clock count and 
the generic fallback compatible (samsung,snps-dwc3) are fine.


dt-bindings: usb: Introduce samsung,snps-dwc3

Add the Samsung Exynos8855 DWC3 binding using a flattened node
representation, where the DWC3 controller is directly
addressable rather than nested as a child node of a glue layer.

This is the first Samsung Exynos binding using the flattened
representation. The existing samsung,exynos-dwc3 binding describes the
parent and child representation used by existing Exynos SoCs, which can
be migrated to the flattened model.

Use the samsung,snps-dwc3 fallback compatible for Samsung Exynos SoCs
sharing the same flattened model can be added by extending the
compatible enum with per SoC clock and property constraints.

Thanks,
Selva
>
>
> Best regards,
> Krzysztof