From: Miquel Raynal <miquel.raynal@bootlin.com>
To: Md Sadre Alam <md.alam@oss.qualcomm.com>
Cc: richard@nod.at, vigneshr@ti.com, tudor.ambarus@linaro.org,
s-k6@ti.com, linux-mtd@lists.infradead.org,
linux-kernel@vger.kernel.org,
varadarajan.narayanan@oss.qualcomm.com
Subject: Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Date: Fri, 07 Aug 2026 15:50:42 +0200 [thread overview]
Message-ID: <875x1mca4t.fsf@bootlin.com> (raw)
In-Reply-To: <20260807064339.1632249-3-md.alam@oss.qualcomm.com> (Md Sadre Alam's message of "Fri, 7 Aug 2026 12:13:39 +0530")
Hi Sadre,
On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam@oss.qualcomm.com> wrote:
> Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> devices.
>
> The W25N01KW shares the same geometry, OOB layout, and ECC
> status handling as the existing W25N01KV, while the W25N02LW
> matches the existing W25N02KV/W25N02KW devices and reuses
> their OOB layout and ECC status callback.
>
> Signed-off-by: Md Sadre Alam <md.alam@oss.qualcomm.com>
> ---
Sashiko raises a point:
- [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
established pattern for Winbond 1.8V SPI NAND devices and is highly
likely a typo for `0xb2, 0x22`.
Can you please check?
Thanks,
Miquèl
prev parent reply other threads:[~2026-08-07 13:50 UTC|newest]
Thread overview: 5+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-08-07 6:43 [PATCH 0/2] mtd: spinand: winbond: add support for additional SPI-NAND devices Md Sadre Alam
2026-08-07 6:43 ` [PATCH 1/2] mtd: spinand: winbond: add support for W25N04LW Md Sadre Alam
2026-08-07 13:52 ` Miquel Raynal
2026-08-07 6:43 ` [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW Md Sadre Alam
2026-08-07 13:50 ` Miquel Raynal [this message]
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