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From: Miquel Raynal <miquel.raynal@bootlin.com>
To: Md Sadre Alam <md.alam@oss.qualcomm.com>
Cc: richard@nod.at,  vigneshr@ti.com,  tudor.ambarus@linaro.org,
	s-k6@ti.com,  linux-mtd@lists.infradead.org,
	linux-kernel@vger.kernel.org,
	 varadarajan.narayanan@oss.qualcomm.com
Subject: Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Date: Fri, 07 Aug 2026 15:50:42 +0200	[thread overview]
Message-ID: <875x1mca4t.fsf@bootlin.com> (raw)
In-Reply-To: <20260807064339.1632249-3-md.alam@oss.qualcomm.com> (Md Sadre Alam's message of "Fri, 7 Aug 2026 12:13:39 +0530")

Hi Sadre,

On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam@oss.qualcomm.com> wrote:

> Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> devices.
>
> The W25N01KW shares the same geometry, OOB layout, and ECC
> status handling as the existing W25N01KV, while the W25N02LW
> matches the existing W25N02KV/W25N02KW devices and reuses
> their OOB layout and ECC status callback.
>
> Signed-off-by: Md Sadre Alam <md.alam@oss.qualcomm.com>
> ---

Sashiko raises a point:

- [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
established pattern for Winbond 1.8V SPI NAND devices and is highly
likely a typo for `0xb2, 0x22`.

Can you please check?

Thanks,
Miquèl

______________________________________________________
Linux MTD discussion mailing list
http://lists.infradead.org/mailman/listinfo/linux-mtd/

WARNING: multiple messages have this Message-ID (diff)
From: Miquel Raynal <miquel.raynal@bootlin.com>
To: Md Sadre Alam <md.alam@oss.qualcomm.com>
Cc: richard@nod.at,  vigneshr@ti.com,  tudor.ambarus@linaro.org,
	s-k6@ti.com,  linux-mtd@lists.infradead.org,
	linux-kernel@vger.kernel.org,
	 varadarajan.narayanan@oss.qualcomm.com
Subject: Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Date: Fri, 07 Aug 2026 15:50:42 +0200	[thread overview]
Message-ID: <875x1mca4t.fsf@bootlin.com> (raw)
In-Reply-To: <20260807064339.1632249-3-md.alam@oss.qualcomm.com> (Md Sadre Alam's message of "Fri, 7 Aug 2026 12:13:39 +0530")

Hi Sadre,

On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam@oss.qualcomm.com> wrote:

> Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> devices.
>
> The W25N01KW shares the same geometry, OOB layout, and ECC
> status handling as the existing W25N01KV, while the W25N02LW
> matches the existing W25N02KV/W25N02KW devices and reuses
> their OOB layout and ECC status callback.
>
> Signed-off-by: Md Sadre Alam <md.alam@oss.qualcomm.com>
> ---

Sashiko raises a point:

- [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
established pattern for Winbond 1.8V SPI NAND devices and is highly
likely a typo for `0xb2, 0x22`.

Can you please check?

Thanks,
Miquèl

  reply	other threads:[~2026-08-07 13:51 UTC|newest]

Thread overview: 18+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-08-07  6:43 [PATCH 0/2] mtd: spinand: winbond: add support for additional SPI-NAND devices Md Sadre Alam
2026-08-07  6:43 ` Md Sadre Alam
2026-08-07  6:43 ` [PATCH 1/2] mtd: spinand: winbond: add support for W25N04LW Md Sadre Alam
2026-08-07  6:43   ` Md Sadre Alam
2026-08-07 13:52   ` Miquel Raynal
2026-08-07 13:52     ` Miquel Raynal
2026-08-10  8:28   ` Dominique MARTINET
2026-08-10  8:28     ` Dominique MARTINET
2026-08-10 12:43     ` Miquel Raynal
2026-08-10 12:43       ` Miquel Raynal
2026-08-11 12:48       ` Md Sadre Alam
2026-08-11 12:48         ` Md Sadre Alam
2026-08-11 12:40     ` Md Sadre Alam
2026-08-11 12:40       ` Md Sadre Alam
2026-08-07  6:43 ` [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW Md Sadre Alam
2026-08-07  6:43   ` Md Sadre Alam
2026-08-07 13:50   ` Miquel Raynal [this message]
2026-08-07 13:50     ` Miquel Raynal

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