Re: [PATCH v3 2/6] dt-bindings: riscv: microchip: document icicle kit with production device

[Conor Dooley <conor@kernel.org>]

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On Tue, Sep 09, 2025 at 08:53:05AM +0200, Krzysztof Kozlowski wrote:
> On Mon, Sep 08, 2025 at 12:57:28PM +0100, Valentina Fernandez wrote:
> > With the introduction of the Icicle Kit using the production MPFS250T
> > device, it's necessary to distinguish it from the engineering sample
> > (-es) variant. Engineering samples cannot write to flash from the MSS,
> > as noted in the PolarFire SoC FPGA ES errata.
> > 
> > Add specific compatibles for the Icicle Kit with Production device
> > (MPFS250T) and Icicle Kit with Engineering Sample (MPFS250T_ES).
> > 
> > The icicle kit reference designs in the v2025.07 release include the
> > Mi-V IHC IP v2, used to send/receive data between clusters when
> > using Asymmetric Multiprocessing (AMP) mode.
> > 
> > In reference design releases prior to v2025.07, the MI-V IHC subsystem
> > was included as a proof of concept in the design prior to becoming an
> > IP available in the Libero catalog.
> > 
> > Among other improvements, the new Mi-V IHC IP v2 includes some
> > changes to the register map. For this reason, make use of a new
> > reference design compatible to denote that v2025.07 reference design
> > releases are not backwards compatible.
> > 
> > Signed-off-by: Valentina Fernandez <valentina.fernandezalanis@microchip.com>
> > ---
> >  Documentation/devicetree/bindings/riscv/microchip.yaml | 8 ++++++++
> >  1 file changed, 8 insertions(+)
> 
> Why are you sending patches which are already applied? For two weeks?

That's probably my bad, I dropped the series when you had complaints
about the version that I applied and forgot to mention it.

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