Re: [PATCH v4 05/10] remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 7/3/26 07:03, Gaurav Kohli wrote:
> Enable Thermal Mitigation Device (TMD) support for PAS-managed CDSP and
> modem remote processors on platforms that expose the QMI TMD service.
> 
> This adds per-platform TMD configuration in qcom_q6v5_pas for:
> - Hamoa (X1E80100) CDSP
> - Kodiak CDSP and modem
> - Lemans (SA8775P) CDSP
> - Talos CDSP
> - Monaco CDSP
> 
> For each remoteproc, the configured TMD QMI instance ID is used to bind to
> the TMD service running on that subsystem (e.g. CDSP: 0x43, modem: 0x0).
> The driver then uses the corresponding TMD endpoint names ("cdsp_sw",
> "pa", "modem") for cooling-device registration.
> 
> QMI TMD identifies mitigation endpoints by name, while DT thermal bindings
> reference cooling devices by id. This change provides the mapping
> between DT cooling indices and QMI TMD names, allowing remoteproc nodes
> with #cooling-cells to act as cooling devices in the thermal framework.
> 
> With this in place, thermal policies can request mitigation from CDSP and
> modem subsystems via QMI under thermal pressure.
> 
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>

Reviewed-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>