[PATCH v1 13/14] thermal/of: Process cooling device index in cooling-spec

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

The new DT bindings format describes a cooling device spec with the
cooling device node, the id and the mitigation limits.

Depending on the version of the DT bindings, in order to bind, check
with the device node pointer only or, in addition, the cooling device
id.

Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
---
 drivers/thermal/thermal_of.c | 22 ++++++++++++++++++++--
 1 file changed, 20 insertions(+), 2 deletions(-)

diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c
index d9bd7dc01e19..e9b39d625b0c 100644
--- a/drivers/thermal/thermal_of.c
+++ b/drivers/thermal/thermal_of.c
@@ -264,11 +264,29 @@ static bool thermal_of_get_cooling_spec(struct device_node *map_np, int index,
 		return false;
 	}
 
+	/*
+	 * There are two formats:
+	 * - Legacy format :	<&cdev lower upper>
+	 * - New format    :	<&cdev of_index lower upper>
+	 *
+	 * With the new format, along with the device node pointer,
+	 * the of_index must match with the cooling device of_index in
+	 * order to bind
+	 */
+	if (cooling_spec.args_count == 3 &&
+	    cooling_spec.args[0] != cdev->of_index)
+		return false;
+
 	if (cooling_spec.np != cdev->np)
 		return false;
 
-	c->lower = cooling_spec.args[0];
-	c->upper = cooling_spec.args[1];
+	if (cooling_spec.args_count != 3) {
+		c->lower = cooling_spec.args[0];
+		c->upper = cooling_spec.args[1];
+	} else {
+		c->lower = cooling_spec.args[1];
+		c->upper = cooling_spec.args[2];
+	}
 	c->weight = weight;
 
 	return true;
-- 
2.43.0