From: sashiko-bot@kernel.org
To: "Daniel Lezcano" <daniel.lezcano@oss.qualcomm.com>
Cc: linux-hwmon@vger.kernel.org
Subject: Re: [PATCH v1 02/14] thermal/driver/tegra/soctherm: Use devm_ variant when registering a cooling device
Date: Sun, 19 Apr 2026 18:38:42 +0000 [thread overview]
Message-ID: <20260419183842.D10FFC2BCAF@smtp.kernel.org> (raw)
In-Reply-To: <20260419182203.4083985-3-daniel.lezcano@oss.qualcomm.com>
Sashiko AI review found 1 potential issue(s):
- [High] Teardown asymmetry / use-after-disable causing kernel panic on probe failure or driver unbind.
--
commit 7cd0558154b37412cd530ca6d0e191a67317cc1e
Author: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
thermal/driver/tegra/soctherm: Use devm_ variant when registering a cooling device
This commit modifies the driver to use the devm_ variant for cooling
device registration, aiming to fix a resource leak at removal time.
> diff --git a/drivers/thermal/tegra/soctherm.c b/drivers/thermal/tegra/soctherm.c
> --- a/drivers/thermal/tegra/soctherm.c
> +++ b/drivers/thermal/tegra/soctherm.c
[ ... ]
> @@ -1700,9 +1700,9 @@ static void soctherm_init_hw_throt_cdev(struct platform_device *pdev)
> stc->init = true;
> } else {
>
> - tcd = thermal_of_cooling_device_register(np_stcc,
> - (char *)name, ts,
> - &throt_cooling_ops);
> + tcd = devm_thermal_of_cooling_device_register(dev, np_stcc,
> + (char *)name, ts,
> + &throt_cooling_ops);
Could this devm transition create a teardown asymmetry that leads to a kernel
panic?
While this prevents the cooling device from leaking, the unregistration is now
deferred until devres_release_all() runs (after probe() returns an error or
remove() completes).
The driver still manually disables the hardware clocks during the probe error
path and in tegra_soctherm_remove(). This creates a window where the cooling
device remains registered and exposed to the thermal core and sysfs while the
underlying hardware is powered down.
If there is a concurrent sysfs read of the cooling device state during this
window, it will invoke throt_get_cdev_cur_state(), which executes:
readl(ts->regs + THROT_STATUS)
Accessing IP block registers with the clocks disabled causes a synchronous
external abort on Tegra.
Should the clock disable operations also be managed via devres (e.g., using
devm_add_action_or_reset()) to guarantee LIFO teardown ordering?
> if (IS_ERR_OR_NULL(tcd)) {
> dev_err(dev,
> "throttle-cfg: %s: failed to register cooling device\n",
--
Sashiko AI review · https://sashiko.dev/#/patchset/20260419182203.4083985-1-daniel.lezcano@oss.qualcomm.com?part=2
next prev parent reply other threads:[~2026-04-19 18:38 UTC|newest]
Thread overview: 23+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-04-19 18:21 [PATCH v1 00/14] Support cooling device with ID in the OF Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 01/14] thermal/of: Move OF code where it belongs to Daniel Lezcano
2026-04-19 18:47 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 02/14] thermal/driver/tegra/soctherm: Use devm_ variant when registering a cooling device Daniel Lezcano
2026-04-19 18:38 ` sashiko-bot [this message]
2026-04-19 18:21 ` [PATCH v1 03/14] thermal/core: Make thermal_cooling_device_init_complete() non static Daniel Lezcano
2026-04-19 18:43 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 04/14] thermal/of: Move the node pointer assignation in the OF code file Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 05/14] thermal/core: Remove node pointer parameter parameter when registering a tz Daniel Lezcano
2026-04-19 18:41 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 06/14] thermal/core: Register cooling device non-OF drivers Daniel Lezcano
2026-04-19 18:29 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 07/14] hwmon:: Use non-OF thermal cooling device register function Daniel Lezcano
2026-04-19 18:47 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 08/14] thermal/core: Move OF functions def in the CONFIG_OF section in thermal.h Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 09/14] thermal/core: Put of_node field cooling device structure under Kconfig option Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 10/14] thermal/of: Rename the devm_thermal_of_cooling_device_register() function Daniel Lezcano
2026-04-19 18:34 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 11/14] thermal/of: Introduce cooling device of_index Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 12/14] thermal/of: Pass the of_index and add a function to register with an index Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 13/14] thermal/of: Process cooling device index in cooling-spec Daniel Lezcano
2026-04-19 18:51 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 14/14] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device Daniel Lezcano
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=20260419183842.D10FFC2BCAF@smtp.kernel.org \
--to=sashiko-bot@kernel.org \
--cc=daniel.lezcano@oss.qualcomm.com \
--cc=linux-hwmon@vger.kernel.org \
--cc=sashiko@lists.linux.dev \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox