From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: rafael@kernel.org
Cc: gaurav.kohli@oss.qualcomm.com, "Zhang Rui" <rui.zhang@intel.com>,
"Lukasz Luba" <lukasz.luba@arm.com>,
"Rob Herring" <robh@kernel.org>,
"Krzysztof Kozlowski" <krzk+dt@kernel.org>,
"Conor Dooley" <conor+dt@kernel.org>,
"Lucas Stach" <l.stach@pengutronix.de>,
"Russell King" <linux+etnaviv@armlinux.org.uk>,
"Christian Gmeiner" <christian.gmeiner@gmail.com>,
"David Airlie" <airlied@gmail.com>,
"Simona Vetter" <simona@ffwll.ch>,
"Guenter Roeck" <linux@roeck-us.net>,
"Joel Stanley" <joel@jms.id.au>,
"Andrew Jeffery" <andrew@codeconstruct.com.au>,
"Thomas Weißschuh" <linux@weissschuh.net>,
"Benson Leung" <bleung@chromium.org>,
"Pali Rohár" <pali@kernel.org>,
"Avi Fishman" <avifishman70@gmail.com>,
"Tomer Maimon" <tmaimon77@gmail.com>,
"Tali Perry" <tali.perry1@gmail.com>,
"Patrick Venture" <venture@google.com>,
"Nancy Yuen" <yuenn@google.com>,
"Benjamin Fair" <benjaminfair@google.com>,
"Heiko Stuebner" <heiko@sntech.de>,
"Thierry Reding" <thierry.reding@gmail.com>,
"Jonathan Hunter" <jonathanh@nvidia.com>,
"Bjorn Andersson" <andersson@kernel.org>,
"Konrad Dybcio" <konradybcio@kernel.org>,
"Amit Daniel Kachhap" <amit.kachhap@gmail.com>,
"Viresh Kumar" <viresh.kumar@linaro.org>,
"Neil Armstrong" <neil.armstrong@linaro.org>,
"Amit Kucheria" <amitk@kernel.org>,
linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-hwmon@vger.kernel.org,
"Daniel Lezcano" <daniel.lezcano@kernel.org>,
devicetree@vger.kernel.org (open list:OPEN FIRMWARE AND
FLATTENED DEVICE TREE BINDINGS)
Subject: [PATCH v1 14/14] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
Date: Sun, 19 Apr 2026 20:21:58 +0200 [thread overview]
Message-ID: <20260419182203.4083985-15-daniel.lezcano@oss.qualcomm.com> (raw)
In-Reply-To: <20260419182203.4083985-1-daniel.lezcano@oss.qualcomm.com>
From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Extend the thermal cooling device binding to support a 3 cells specifier
along with tje 2 cells format.
Update #cooling-cells property to enum to support both 2 and 3 arguments.
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
---
.../bindings/thermal/thermal-cooling-devices.yaml | 8 ++++++--
.../devicetree/bindings/thermal/thermal-zones.yaml | 3 ++-
2 files changed, 8 insertions(+), 3 deletions(-)
diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
index b9022f1613d8..28f5818f1e60 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -44,10 +44,14 @@ select: true
properties:
"#cooling-cells":
description:
- Must be 2, in order to specify minimum and maximum cooling state used in
+ Must be 2 or 3. If 2, specifies minimum and maximum cooling state used in
the cooling-maps reference. The first cell is the minimum cooling state
and the second cell is the maximum cooling state requested.
- const: 2
+ If 3, the first cell specifies the thermal mitigation device specifier
+ index for devices that support multiple thermal mitigation mechanisms.
+ The two other cells are respectively the minimum cooling state and the
+ maximum cooling state.
+ enum: [2, 3]
additionalProperties: true
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
index 0de0a9757ccc..1261ba0e802e 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -214,7 +214,8 @@ patternProperties:
device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
cooling-device phandle limit specifier lets the framework
use the minimum and maximum cooling state for that cooling
- device automatically.
+ device automatically. If three arguments are specified,
+ the first argument is the cooling device specifier.
contribution:
$ref: /schemas/types.yaml#/definitions/uint32
--
2.43.0
prev parent reply other threads:[~2026-04-19 18:23 UTC|newest]
Thread overview: 23+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-04-19 18:21 [PATCH v1 00/14] Support cooling device with ID in the OF Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 01/14] thermal/of: Move OF code where it belongs to Daniel Lezcano
2026-04-19 18:47 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 02/14] thermal/driver/tegra/soctherm: Use devm_ variant when registering a cooling device Daniel Lezcano
2026-04-19 18:38 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 03/14] thermal/core: Make thermal_cooling_device_init_complete() non static Daniel Lezcano
2026-04-19 18:43 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 04/14] thermal/of: Move the node pointer assignation in the OF code file Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 05/14] thermal/core: Remove node pointer parameter parameter when registering a tz Daniel Lezcano
2026-04-19 18:41 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 06/14] thermal/core: Register cooling device non-OF drivers Daniel Lezcano
2026-04-19 18:29 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 07/14] hwmon:: Use non-OF thermal cooling device register function Daniel Lezcano
2026-04-19 18:47 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 08/14] thermal/core: Move OF functions def in the CONFIG_OF section in thermal.h Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 09/14] thermal/core: Put of_node field cooling device structure under Kconfig option Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 10/14] thermal/of: Rename the devm_thermal_of_cooling_device_register() function Daniel Lezcano
2026-04-19 18:34 ` sashiko-bot
2026-04-19 18:21 ` [PATCH v1 11/14] thermal/of: Introduce cooling device of_index Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 12/14] thermal/of: Pass the of_index and add a function to register with an index Daniel Lezcano
2026-04-19 18:21 ` [PATCH v1 13/14] thermal/of: Process cooling device index in cooling-spec Daniel Lezcano
2026-04-19 18:51 ` sashiko-bot
2026-04-19 18:21 ` Daniel Lezcano [this message]
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