From: Md Sadre Alam <md.alam@oss.qualcomm.com>
To: Miquel Raynal <miquel.raynal@bootlin.com>
Cc: richard@nod.at, vigneshr@ti.com, tudor.ambarus@linaro.org,
s-k6@ti.com, linux-mtd@lists.infradead.org,
linux-kernel@vger.kernel.org,
varadarajan.narayanan@oss.qualcomm.com
Subject: Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Date: Tue, 11 Aug 2026 18:27:46 +0530 [thread overview]
Message-ID: <anscSq0A9hPL8uXT@hu-mdalam-blr.qualcomm.com> (raw)
In-Reply-To: <875x1mca4t.fsf@bootlin.com>
On Fri, Aug 07, 2026 at 03:50:42PM +0200, Miquel Raynal wrote:
> Hi Sadre,
>
> On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam@oss.qualcomm.com> wrote:
>
> > Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> > devices.
> >
> > The W25N01KW shares the same geometry, OOB layout, and ECC
> > status handling as the existing W25N01KV, while the W25N02LW
> > matches the existing W25N02KV/W25N02KW devices and reuses
> > their OOB layout and ECC status callback.
> >
> > Signed-off-by: Md Sadre Alam <md.alam@oss.qualcomm.com>
> > ---
>
> Sashiko raises a point:
>
> - [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
> established pattern for Winbond 1.8V SPI NAND devices and is highly
> likely a typo for `0xb2, 0x22`.
>
> Can you please check?
I checked the W25N02LW datasheet, section 8.1.1 "Manufacturer and Device
Identification". It lists the W25N02LW Device ID as 1222h.
Thanks,
Alam.
WARNING: multiple messages have this Message-ID (diff)
From: Md Sadre Alam <md.alam@oss.qualcomm.com>
To: Miquel Raynal <miquel.raynal@bootlin.com>
Cc: richard@nod.at, vigneshr@ti.com, tudor.ambarus@linaro.org,
s-k6@ti.com, linux-mtd@lists.infradead.org,
linux-kernel@vger.kernel.org,
varadarajan.narayanan@oss.qualcomm.com
Subject: Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Date: Tue, 11 Aug 2026 18:27:46 +0530 [thread overview]
Message-ID: <anscSq0A9hPL8uXT@hu-mdalam-blr.qualcomm.com> (raw)
In-Reply-To: <875x1mca4t.fsf@bootlin.com>
On Fri, Aug 07, 2026 at 03:50:42PM +0200, Miquel Raynal wrote:
> Hi Sadre,
>
> On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam@oss.qualcomm.com> wrote:
>
> > Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> > devices.
> >
> > The W25N01KW shares the same geometry, OOB layout, and ECC
> > status handling as the existing W25N01KV, while the W25N02LW
> > matches the existing W25N02KV/W25N02KW devices and reuses
> > their OOB layout and ECC status callback.
> >
> > Signed-off-by: Md Sadre Alam <md.alam@oss.qualcomm.com>
> > ---
>
> Sashiko raises a point:
>
> - [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
> established pattern for Winbond 1.8V SPI NAND devices and is highly
> likely a typo for `0xb2, 0x22`.
>
> Can you please check?
I checked the W25N02LW datasheet, section 8.1.1 "Manufacturer and Device
Identification". It lists the W25N02LW Device ID as 1222h.
Thanks,
Alam.
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next prev parent reply other threads:[~2026-08-11 12:58 UTC|newest]
Thread overview: 20+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-08-07 6:43 [PATCH 0/2] mtd: spinand: winbond: add support for additional SPI-NAND devices Md Sadre Alam
2026-08-07 6:43 ` Md Sadre Alam
2026-08-07 6:43 ` [PATCH 1/2] mtd: spinand: winbond: add support for W25N04LW Md Sadre Alam
2026-08-07 6:43 ` Md Sadre Alam
2026-08-07 13:52 ` Miquel Raynal
2026-08-07 13:52 ` Miquel Raynal
2026-08-10 8:28 ` Dominique MARTINET
2026-08-10 8:28 ` Dominique MARTINET
2026-08-10 12:43 ` Miquel Raynal
2026-08-10 12:43 ` Miquel Raynal
2026-08-11 12:48 ` Md Sadre Alam
2026-08-11 12:48 ` Md Sadre Alam
2026-08-11 12:40 ` Md Sadre Alam
2026-08-11 12:40 ` Md Sadre Alam
2026-08-07 6:43 ` [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW Md Sadre Alam
2026-08-07 6:43 ` Md Sadre Alam
2026-08-07 13:50 ` Miquel Raynal
2026-08-07 13:50 ` Miquel Raynal
2026-08-11 12:57 ` Md Sadre Alam [this message]
2026-08-11 12:57 ` Md Sadre Alam
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