From: Maximilian Luz <luzmaximilian@gmail.com>
To: Konrad Dybcio <konradybcio@kernel.org>,
Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.com>,
Hans de Goede <hdegoede@redhat.com>,
Ivor Wanders <ivor@iwanders.net>,
linux-kernel@vger.kernel.org, linux-hwmon@vger.kernel.org
Subject: Re: [PATCH v2] hwmon: Add thermal sensor driver for Surface Aggregator Module
Date: Sat, 10 Aug 2024 03:04:20 +0200 [thread overview]
Message-ID: <4464d0f5-1a40-40b9-8d53-7f0d75b9d062@gmail.com> (raw)
In-Reply-To: <6027d9db-b1a8-4eb0-a0b7-451f1524834c@kernel.org>
On 8/10/24 1:35 AM, Konrad Dybcio wrote:
> On 5.08.2024 1:08 AM, Maximilian Luz wrote:
>> Some of the newer Microsoft Surface devices (such as the Surface Book
>> 3 and Pro 9) have thermal sensors connected via the Surface Aggregator
>> Module (the embedded controller on those devices). Add a basic driver
>> to read out the temperature values of those sensors.
>>
>> The EC can have up to 16 thermal sensors connected via a single
>> sub-device, each providing temperature readings and a label string.
>>
>> Link: https://github.com/linux-surface/surface-aggregator-module/issues/59
>> Reviewed-by: Hans de Goede <hdegoede@redhat.com>
>> Co-developed-by: Ivor Wanders <ivor@iwanders.net>
>> Signed-off-by: Ivor Wanders <ivor@iwanders.net>
>> Signed-off-by: Maximilian Luz <luzmaximilian@gmail.com>
>>
>> ---
>
> Gave it a shot on SL7, some names are repeated and one sensor is
> totally busted
>
> /sys/class/hwmon/hwmon66/name:surface_thermal
> /sys/class/hwmon/hwmon66/temp10_input:32200
> /sys/class/hwmon/hwmon66/temp10_label:I_RTS2
> /sys/class/hwmon/hwmon66/temp11_input:31600
> /sys/class/hwmon/hwmon66/temp11_label:I_RTS3
> /sys/class/hwmon/hwmon66/temp12_input:38000
> /sys/class/hwmon/hwmon66/temp12_label:I_RTS4
> /sys/class/hwmon/hwmon66/temp1_input:43900
> /sys/class/hwmon/hwmon66/temp1_label:I_RTS1
> /sys/class/hwmon/hwmon66/temp2_input:44000
> /sys/class/hwmon/hwmon66/temp2_label:I_RTS2
> /sys/class/hwmon/hwmon66/temp3_input:47300
> /sys/class/hwmon/hwmon66/temp3_label:I_RTS3
> /sys/class/hwmon/hwmon66/temp4_input:-273100
> /sys/class/hwmon/hwmon66/temp4_label:I_RTS4
> /sys/class/hwmon/hwmon66/temp5_input:31300
> /sys/class/hwmon/hwmon66/temp5_label:I_RTS5
> /sys/class/hwmon/hwmon66/temp9_input:37100
> /sys/class/hwmon/hwmon66/temp9_label:I_RTS1
Hmm, on the SPX it looks like this:
I_RTS1: +31.9°C
I_RTS2: +31.3°C
I_RTS3: +31.4°C
I_RTS4: +28.3°C
I_RTS5: +29.3°C
I_RTS6: +29.3°C
I_RTS7: +29.3°C
I_RTS8: +29.3°C
VTS1: +30.2°C
VTS2: +0.0°C
VTS3: +0.0°C
VTS4: +0.0°C
VTS5: +0.0°C
So VTS2-5 seem like they may not actually be connected, but the rest at
least look somewhat sensible. I'd probably still keep the names as they
at least might give an indication what the sensors could be for.
But there's a good chance that we're missing something on how MS
envisions these sensors to work exactly.
Regards,
Max
next prev parent reply other threads:[~2024-08-10 1:04 UTC|newest]
Thread overview: 14+ messages / expand[flat|nested] mbox.gz Atom feed top
2024-08-04 23:08 [PATCH v2] hwmon: Add thermal sensor driver for Surface Aggregator Module Maximilian Luz
2024-08-06 19:41 ` kernel test robot
2024-08-07 0:32 ` Guenter Roeck
2024-08-07 19:25 ` Maximilian Luz
2024-08-07 19:50 ` Guenter Roeck
2024-08-07 20:11 ` Maximilian Luz
2024-08-07 20:37 ` Guenter Roeck
2024-08-10 1:19 ` Maximilian Luz
2024-08-09 23:35 ` Konrad Dybcio
2024-08-10 0:34 ` Ivor Wanders
2024-08-10 1:04 ` Maximilian Luz [this message]
2024-08-10 1:14 ` Konrad Dybcio
2024-08-19 10:26 ` Konrad Dybcio
2024-08-19 20:03 ` Maximilian Luz
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