Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 3/17/2026 1:27 AM, Daniel Lezcano wrote:
> On Tue, Feb 24, 2026 at 01:17:22PM +0100, Krzysztof Kozlowski wrote:
>> On 24/02/2026 13:09, Gaurav Kohli wrote:
> 
> [ ... ]
> 
>>>>> As a result, each core requires its own cooling device, which must be
>>>>> linked to its TSENS thermal zone. Because of this, we introduced
>>>>> multiple child nodes—one for each cooling device.
>>>>
>>>> So you have one device with cooling cells=1+2, no?
>>>>
>>>
>>> This will be a bigger framework change which is not supported, i can see
>>
>> I don't think that changing open source frameworks is "not supported". I
>> am pretty sure that changing is not only supported, but actually desired.
> 
> Yes, IMO it could make sense. There are the thermal zones with phandle
> to a sensor and a sensor id. We can have the same with a phandle to a
> cooling device and a cooling device id.
> 
> (... or several ids because the thermal sensor can also have multiple
> ids ?)
> 
> May be an array of names corresponding to the TMD names at the 'id'
> position ?
> 

I am using dt node like below to use with cooling-cells = <3> approach, 
will post new patches with that.

cdsp_tmd: cdsp-tmd {
	compatible = "qcom,qmi-cooling-cdsp";
	tmd-names = "cdsp_sw", "cdsp_hw";
	#cooling-cells = <3>;
};

please let me know, if you are expecting something like this only.

thanks
Gaurav