Re: [PATCH v2 1/8] thermal: Add Remote Proc cooling driver

[Lukasz Luba <lukasz.luba@arm.com>]

On 3/6/26 09:19, Daniel Lezcano wrote:
> On Tue, Jan 27, 2026 at 09:27:15PM +0530, Gaurav Kohli wrote:
>> Add a new generic driver for thermal cooling devices that control
>> remote processors (modem, DSP, etc.) through various communication
>> channels.
>>
>> This driver provides an abstraction layer between the thermal
>> subsystem and vendor-specific remote processor communication
>> mechanisms.
>>
>> Advantage of this to avoid duplicating vendor-specific logic
>> in the thermal subsystem and make it easier for different vendors
>> to plug in their own cooling mechanisms via callbacks.
> 
> These changes add a layer on top of another existing without bringing
> a real benefit. At the first glance, it appears to be an ops calling
> an ops with an extra unneeded lock.
> 
> IMO, a remote proc cooling device should at least group all common
> rproc calls found in the different SoC doing the same thing. Otherwise
> it is not worth to add it.
> 

I agree with Daniel here. I thought we would have many such SoCs and
a common problem to solve in the fwk layer. When we discussed at LPC25
this needed feature I got an impression this is the case.

Do we have other SoCs which would benefit from this design approach?

If not, then it would be better to put this code next to the SoC's
driver code and not expose it.

Regards,
Lukasz