Re: [PATCH v2 5/8] arm64: dts: qcom: lemans: Enable CDSP cooling

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 1/29/2026 5:59 PM, Dmitry Baryshkov wrote:
> On Thu, Jan 29, 2026 at 05:40:56PM +0530, Gaurav Kohli wrote:
>> On 1/29/2026 6:13 AM, Dmitry Baryshkov wrote:
>>> On Tue, Jan 27, 2026 at 09:27:19PM +0530, Gaurav Kohli wrote:
>>>> Unlike the CPU, the CDSP does not throttle its speed automatically
>>>> when it reaches high temperatures in Lemans.
>>>>
>>>> Set up CDSP cooling by throttling the cdsp when it reaches 105°C.
>>>>
>>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>> ---
>>>>    arch/arm64/boot/dts/qcom/lemans.dtsi | 138 ++++++++++++++++++++++++---
>>>>    1 file changed, 126 insertions(+), 12 deletions(-)
>>>>
>>>> diff --git a/arch/arm64/boot/dts/qcom/lemans.dtsi b/arch/arm64/boot/dts/qcom/lemans.dtsi
>>>> index 808827b83553..c747dd534caa 100644
>>>> --- a/arch/arm64/boot/dts/qcom/lemans.dtsi
>>>> +++ b/arch/arm64/boot/dts/qcom/lemans.dtsi
>>>> @@ -7281,6 +7281,15 @@ compute-cb@11 {
>>>>    					};
>>>>    				};
>>>>    			};
>>>> +
>>>> +			cooling {
>>>> +				compatible = "qcom,qmi-cooling-cdsp";
>>>> +
>>>> +				cdsp_tmd0: cdsp-tmd0 {
>>> This question was already raised. Are there more than one cooling device
>>> for the DSP? If not, drop the subnodes.
>>
>> Thanks Dmitry for review.
>>
>> Yes, Each subsystem may support multiple thermal mitigation devices through
>> remote TMD service.
> May or does?


It does support. that's why need child node to trigger different mitigation.


>
>> So, need to define subnodes.
>>
>>
>>>> +					label = "cdsp_sw";
>>>> +					#cooling-cells = <2>;
>>>> +				};
>>>> +			};
>>>>    		};
>>>>    		nspb_noc: interconnect@2a0c0000 {