Re: [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev

[Lukasz Luba <lukasz.luba@arm.com>]

On 5/13/26 16:06, Rafael J. Wysocki wrote:
> On Wed, May 13, 2026 at 4:22 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>>
>> Hi Rafael,
>>
>> On 5/8/26 20:10, Daniel Lezcano wrote:
>>> On 5/8/26 20:05, Daniel Lezcano wrote:
>>>> This series cleans up the lifetime handling of thermal devices.
>>>>
>>>> Currently, the thermal class release callback handles both thermal
>>>> zones and cooling devices by checking the device name prefix. This
>>>> approach is fragile and mixes responsibilities across different object
>>>> types.
>>>>
>>>> The first two patches introduce dedicated struct device release
>>>> callbacks for thermal zones and cooling devices. This removes the need
>>>> to rely on device names and keeps the lifetime management local to
>>>> each object.
>>>>
>>>> The last two patches convert the thermal class to a dynamically
>>>> allocated object and simplify the initialization logic by using the
>>>> class pointer itself as a guard instead of a separate boolean flag.
>>>>
>>>> Overall, this results in a clearer separation of responsibilities and
>>>> more robust lifetime management aligned with the device model.
>>>>
>>>> No functional change intended.
>>> Unless I’m mistaken, the patch sent to split the cooling device
>>> registration is correct with this cleanup.
>>
>> Were you able to apply the patch splitting the cooling device
>> registration on top of this series ?
> 
> I haven't tried that yet, but I'll do it later today.

Just to double check, we are talking about this patch (that we discussed
back then):

https://lore.kernel.org/lkml/20260505144447.2853933-1-daniel.lezcano@oss.qualcomm.com/

With the re-work done here, I can put my review tag into
that patch. The error handling paths there should be safe now.