Re: [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

Hi Rafael,

On 5/8/26 20:10, Daniel Lezcano wrote:
> On 5/8/26 20:05, Daniel Lezcano wrote:
>> This series cleans up the lifetime handling of thermal devices.
>>
>> Currently, the thermal class release callback handles both thermal
>> zones and cooling devices by checking the device name prefix. This
>> approach is fragile and mixes responsibilities across different object
>> types.
>>
>> The first two patches introduce dedicated struct device release
>> callbacks for thermal zones and cooling devices. This removes the need
>> to rely on device names and keeps the lifetime management local to
>> each object.
>>
>> The last two patches convert the thermal class to a dynamically
>> allocated object and simplify the initialization logic by using the
>> class pointer itself as a guard instead of a separate boolean flag.
>>
>> Overall, this results in a clearer separation of responsibilities and
>> more robust lifetime management aligned with the device model.
>>
>> No functional change intended.
> Unless I’m mistaken, the patch sent to split the cooling device 
> registration is correct with this cleanup.

Were you able to apply the patch splitting the cooling device 
registration on top of this series ?